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| Brand Name: FOISON | Certification: ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Model Number: FSD0002L0888 | Minimum Order Quantity: 1 |
| Delivery Time: 5-8 working days | Payment Terms: T/T, Western Union, L/C |
| Foisontech Corporation Co., Limited [Guangdong,China] | |
| Active Member | |
| Brand Name: FOISON | Certification: ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Model Number: FSD0002L06666 | Minimum Order Quantity: 1 |
| Delivery Time: 5-8 working days | Payment Terms: T/T, Western Union, L/C |
| Foisontech Corporation Co., Limited [Guangdong,China] | |
| Active Member | |
| Brand Name: FOISON | Certification: ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Model Number: FSD0002L06666 | Minimum Order Quantity: 1 |
| Delivery Time: 5-8 working days | Payment Terms: T/T, Western Union, L/C |
| Foisontech Corporation Co., Limited [Guangdong,China] | |
| Active Member | |
| Brand Name: Material | Certification: Board Thickness |
| Model Number: Copper thickness | Place of Origin: Layers |
| Layers: 8 Layer | Material: ShengYi S1000 |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |
| Layers: 20 Layers | Material: Shengyi S1000 |
| Board Thickness: 2.0 MM | Copper thickness: 1OZ |
| Surface finish: ENIG 3U" | Special technology: 0.2mm BGA |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |
| Brand Name: Material | Certification: Board Thickness |
| Model Number: Copper thickness | Place of Origin: Layers |
| Layers: 8 Layer | Material: ShengYi S1000 |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |
| Layers: 12 Layers | Material: TACNIC TSM-DS3 |
| Board Thickness: 2.9 MM | Copper thickness: 1 OZ |
| Surface finish: ENIG | Special technology: 4+N+4 HDI Rigid Flex PCBs |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |
| Layers: 14 Layers | Material: TG180 IT180 |
| Board Thickness: 1.6 MM | Copper thickness: 1 OZ |
| Surface finish: ENIG | Special technology: 2+N+2 |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |
| Layers: 12 Layers | Material: Shengyi S1000 TG170 |
| Board Thickness: 1.6MM | Copper thickness: 1OZ |
| Surface finish: ENIG 3u” | Special technology: Stacked laser holes PCBs |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |
| Layers: 14 Layers | Material: ITEQ IT180 |
| Board Thickness: 1.6MM | Copper thickness: 1 OZ |
| Surface finish: ENIG 3u" | Special technology: 0.075MM laser holes |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |
| Layers: 8 Layers | Material: ITEQ IT180 |
| Board Thickness: 0.8MM | Copper thickness: 1 OZ |
| Surface finish: ENIG 3U" | Special technology: blind&burried holes |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |
| Layers: 8 Layers | Material: Shengyi S1000 |
| Board Thickness: 0.8 MM | Copper thickness: 1 OZ |
| Surface finish: ENIG 3U" | Special technology: Blind hole buried hole micro hole |
| LT CIRCUIT CO.,LTD. [China] | |
| Verified Supplier | |