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8 Layer High Density Interconnect Boards

8 layer high density interconnect boards

1,547 Results
All Verified 8 layer high density interconnect boards suppliers & 8 layer high density interconnect boards manufacturers have passed our Business License Check, they can provide quality 8 layer high density interconnect boards products.
2oz HDI PCB with 0.07mm Laser Drill, 0.04mm Line Width, and 0.3mm BGA Pitch for High Density Interconnect Applications Manufactures
2oz HDI PCB with 0.07mm Laser Drill, 0.04mm Line Width, and 0.3mm BGA Pitch for High Density Interconnect Applications
Brand Name: Kingtech Certification: GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000
Minimum Order Quantity: 1pcs Delivery Time: 2-7days
Payment Terms: By quote Place of Origin: China
HONGKONG KINGTECH PCB SOLUTION LIMITED [China]
Verified Supplier
Multilayer Electronics PCBA Printed Circuit Board Assembly High Density Wiring Board For Tablet Manufactures
Multilayer Electronics PCBA Printed Circuit Board Assembly High Density Wiring Board For Tablet
Brand Name: XSW PCB Certification: UL ,IOS9000
Model Number: XSWPCB Minimum Order Quantity: 1
Delivery Time: 8-15DAYS Payment Terms: Western Union
Shenzhen Xunsiwei Circuit Co., Ltd. [Guangdong,China]
Verified Supplier
High Density Interconnect Assembly optimized for high speed signal transmission and interconnection in complex electronic systems Manufactures
High Density Interconnect Assembly optimized for high speed signal transmission and interconnection in complex electronic systems
Brand Name: HTF Certification: ISO9001:2015, ROHS certifications, UL, FCC and CE IATF16949
Place of Origin: Guangdong, China
Shenzhen Haitian Feng Technology Co., Ltd. [China]
Verified Supplier
High Density PCBA Board Interconnect PCB Assembly Board SMT manufacturing Manufactures
High Density PCBA Board Interconnect PCB Assembly Board SMT manufacturing
Brand Name: OEM/ODM Certification: UL,RoHS, CE
Model Number: SL80224S008 Minimum Order Quantity: 1pc
Delivery Time: 5-7 days Payment Terms: T/T, Western Union, ,Paypal
Shenzhen Shinelink Technology Ltd [Guangdong,China]
Verified Supplier
14 Layers 2.0mm Plate Thickness 3/3mil Line Distance HDI PCB Board for High-Density Interconnect Applications Manufactures
14 Layers 2.0mm Plate Thickness 3/3mil Line Distance HDI PCB Board for High-Density Interconnect Applications
Brand Name: GS Model Number: GS14C1JHDLB
Minimum Order Quantity: 1PCS Delivery Time: 5-15 days
Payment Terms: T/T Place of Origin: China
Global Soul Limited [China]
Verified Supplier
4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes Manufactures
4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes
Brand Name: XCE Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEHDI PCB Minimum Order Quantity: 1pc
Place of Origin: China Price: negotiation
Shenzhen Xinchenger Electronic Co.,Ltd [Guangdong,China]
Site Member
4 Layer High Density PCB 94v0 PCB Circuit Board Pcb Fabrication With Immersion Gold Manufactures
4 Layer High Density PCB 94v0 PCB Circuit Board Pcb Fabrication With Immersion Gold
Brand Name: Abis Certification: ISO14001, ISO9001, UL, cUL, TS16949
Minimum Order Quantity: 1 Delivery Time: 7-15working days
Payment Terms: T/T, Western Union, paypal ect. Place of Origin: Made in China
Abis Circuits Co., Ltd. [Guangdong,China]
Active Member
Military Aerospace Pcb Assembly Manufacturer 24 Layer High Density Manufactures
Military Aerospace Pcb Assembly Manufacturer 24 Layer High Density
Brand Name: FASTPCB Minimum Order Quantity: 10PCS
Payment Terms: L/C, T/T Place of Origin: CHINA
Price: USD 0.01-100/PCS Supply Ability: 25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Quanhong FASTPCB [Guangdong,China]
Active Member
Military Aerospace Pcb Assembly Manufacturer 24 Layer High Density Manufactures
Military Aerospace Pcb Assembly Manufacturer 24 Layer High Density
Brand Name: FASTPCB Minimum Order Quantity: 10PCS
Payment Terms: L/C, T/T Place of Origin: CHINA
Price: USD 0.01-100/PCS Supply Ability: 25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Quanhong FASTPCB [Guangdong,China]
Verified Supplier
24 Layer High Density High Speed PCB Circuit Board Control Board Pcb Manufactures
24 Layer High Density High Speed PCB Circuit Board Control Board Pcb
Brand Name: FASTPCB Minimum Order Quantity: 10PCS
Payment Terms: L/C, T/T Place of Origin: CHINA
Price: USD 0.01-100/PCS Supply Ability: 25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Quanhong FASTPCB [Guangdong,China]
Active Member
24 Layer High Density High Speed PCB Circuit Board Control Board Pcb Manufactures
24 Layer High Density High Speed PCB Circuit Board Control Board Pcb
Brand Name: FASTPCB Minimum Order Quantity: 10PCS
Payment Terms: L/C, T/T Place of Origin: CHINA
Price: USD 0.01-100/PCS Supply Ability: 25,000 ㎡ / month Or 10PCS/48Hour（Double-Sided Printed Board）Or 10PCS/72Hour（Multilayer printed circuit board ）
Quanhong FASTPCB [Guangdong,China]
Verified Supplier
1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement Manufactures
1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement
Surface Mount Technology: Available Thickness: 1.6mm, ±10%
Min. Solder Mask Bridge: 0.075mm Vip Process: Yes
Vias Aspect Ratio: 16:1 Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
LT CIRCUIT CO.,LTD. [China]
Verified Supplier
14 Layers 1 Level HDI PCB with 2.0mm Thickness for High-Density Interconnect Applications Manufactures
14 Layers 1 Level HDI PCB with 2.0mm Thickness for High-Density Interconnect Applications
Brand Name: GS Model Number: GS14C1JHDLB
Minimum Order Quantity: 1PCS Delivery Time: 5-15 days
Payment Terms: T/T Place of Origin: China
Global Soul Limited [China]
Verified Supplier
Multilayer Circuit Board High Density Interconnect Assembly Solutions for Complex Electronic Applications and Performance Manufactures
Multilayer Circuit Board High Density Interconnect Assembly Solutions for Complex Electronic Applications and Performance
Brand Name: HTF Certification: ISO9001:2015, ROHS certifications, UL, FCC and CE IATF16949
Place of Origin: Guangdong, China
Shenzhen Haitian Feng Technology Co., Ltd. [China]
Verified Supplier
18 Layers High Density Interconnector High Speed PCB Board Within 10 1 Aspect Ratio Vipppo ENIG + Flash Gold Manufactures
18 Layers High Density Interconnector High Speed PCB Board Within 10 1 Aspect Ratio Vipppo ENIG + Flash Gold
Layer Count: 4-20 Layers Pcb Name: 4L 1+N+1 HDI Boards
Testing: 100%E-Testing,X-RAY Hole Size: 0.1mm Laser Drill
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil) Thickness: 0.4-3.2mm
LT CIRCUIT CO.,LTD. [China]
Verified Supplier
HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards Manufactures
HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards
Brand Name: XCE Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEH Minimum Order Quantity: 1pcs
Delivery Time: 5-10 days Payment Terms: T/T,Western union
Shenzhen Xinchenger Electronic Co.,Ltd [Guangdong,China]
Site Member
HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards Manufactures
HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards
Brand Name: XCE Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEH Minimum Order Quantity: 1pcs
Delivery Time: 5-10 days Payment Terms: T/T,Western union
Shenzhen Xinchenger Electronic Co.,Ltd [Guangdong,China]
Site Member
Lamp Socket FR4 It180 High Density Interconnect PCB 6L 4-20 Layers Manufactures
Lamp Socket FR4 It180 High Density Interconnect PCB 6L 4-20 Layers
Raw Material: FR4 IT180 Impedance Control: Yes
Board Layer: 6L Layer Count: 4-20 Layers
Special Requirements: Lamp Socket Testing: 100%E-Testing,X-RAY
LT CIRCUIT CO.,LTD. [China]
Verified Supplier
High Density Interconnector High Density Model Board with Special Requirements and Lamp Socket Manufactures
High Density Interconnector High Density Model Board with Special Requirements and Lamp Socket
Aspect Ratio: 10:1 Raw Material: FR4 IT180
Thickness: 0.4-3.2mm Special Requirements: Lamp Socket
Board Layer: 6-32L Impedance Control: Yes
LT CIRCUIT CO.,LTD. [China]
Verified Supplier
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