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Wafer Level Chip Scale Package

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wafer level chip scale package

from 1339 Products

Two channel EMI filter Nexperia PCMF2HDMI2SZ with wafer level chip scale package and ESD protection up to 15 kV

China Two channel EMI filter Nexperia PCMF2HDMI2SZ with wafer level chip scale package and ESD protection up to 15 kV on sale
Product Overview Common-mode ElectroMagnetic Interference (EMI) filters with integrated ElectroStatic Discharge (ESD) protection for one, two, and three differential channels. These devices are engineered to provide low insertion loss for high-speed ......
Beijing Silk Road Enterprise Management Services Co., Ltd.

Address: 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing

ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC

China ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC on sale
...Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale...
Shenzhen Hiner Technology Co., Ltd.

Address: Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN

TPS63036YFGR Power Management ICs High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package 8-UFBGA

China TPS63036YFGR Power Management ICs  High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package 8-UFBGA on sale
TPS63036YFGR Power Management ICs High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package 8-UFBGA Product Status Active Function Step-Up/Step-Down Output Configuration Positive Topology Buck-Boost Output Type ......
Shenzhen Sai Collie Technology Co., Ltd.

Address: 1702, Dingcheng international building, Zhonghang Road, Futian District, Shenzhen

SME-8200 Spray Cleaning Equipment For Wafer Level Chip Level Packaging Processes

China SME-8200 Spray Cleaning Equipment For Wafer Level Chip Level Packaging Processes on sale
Product Description: The Semiconductor Cleaning Machine is an automatic cleaning device that is designed to effectively remove water-based flux and other types of contamination from various electronic components. Measuring 8250*1970*1770mm (L*W*H), this ......
Dongguan Shenhua Mechanical and Electrical Equipment ...

Address: Building 3, No.12, Wusha Zhenyuan Road, Chang'an Town, Dongguan City, Guangdong Province

Ultra digital thermal orientation sensor MEMSIC MXC6255XC with chip scale package and I2C interface

China Ultra digital thermal orientation sensor MEMSIC MXC6255XC with chip scale package and I2C interface on sale
Product Overview The MEMSIC MXC6255XC is a fully integrated, ultra-low-cost digital thermal orientation sensor with a chip-scale package. Utilizing patented MEMS-thermal technology and a standard 0.18um CMOS process, it offers robust orientation detection......
Changsha Purple Horn E-Commerce Co., Ltd.

Address: 2332 Kaibin Commercial Plaza, No. 419 Shaoshan Middle Road, Shazitang Street, Yuhua District, Changsha City, Hunan Province

±10μm Accuracy Wafer-Level Underfill Flux Dispensing System Advanced Packaging Equipment

China ±10μm Accuracy Wafer-Level Underfill Flux Dispensing System Advanced Packaging Equipment on sale
...Wafer-Level Underfill Dispenser is Mingseal’s flagship dispensing module designed for next-generation wafer-level packaging (WLP) and advanced redistribution layer (RDL) processes. Built to handle high-complexity underfill and flux spray operations, it is ideal for Fan-Out Wafer-Level Packaging......
Changzhou Mingseal Robot Technology Co., Ltd.

Address: Mingseal Intelligent Manufacturing Center Building, No. 18-98 Middle changwu Road, wujin District, Changzhou,Jiangsu, China

Wafer-Level BGA MOS Capacitor 100 pF 30V Micro-Bump Ready Flip-Chip Chip for Bondwire-Free RF Assembly

China Wafer-Level BGA MOS Capacitor 100 pF 30V Micro-Bump Ready Flip-Chip Chip for Bondwire-Free RF Assembly on sale
...Wafer-Level BGA MOS Capacitor — 100 pF 30V Flip-Chip Ready In short: The HFC101S30V100 is a 100 pF, 30 V single-layer MOS capacitor built on high-resistivity float-zone silicon with a thermally grown SiO2 dielectric. It is supplied with wafer-level micro-bump (BGA) termination for flip-chip......
HongAn Microwave Co., Ltd.

Address: F7, Building 2, Xinkai Industrial Park, Jinye 2nd Road, High-tech Zone, Xi'an

High Resolution 640x512 12μm FPA Uncooled IR Detector with Wafer Level Packaging for Thermal Night Vision

China High Resolution 640x512 12μm FPA Uncooled IR Detector with Wafer Level Packaging for Thermal Night Vision on sale
...Wafer Level Packaging (WLP) detector series, delivering exceptional thermal imaging performance for demanding applications. Wafer Level Packaging (WLP) technology enables high vacuum packaging directly on the entire MEMS wafer, followed by scribing and cutting to produce ......
Wuhan SensorMicro Technology Co., Ltd

Address: No. 9 Qiming 1st Road, East Lake High-tech Development Zone, Wuhan 430205, P.R.China

Wafer Level Hysteresis Loop Instrument Non Destructive Wafer Measurement System

China Wafer Level Hysteresis Loop Instrument Non Destructive Wafer Measurement System on sale
Wafer-Level Hysteresis Loop Measurement Instrument Product Introduction Using polar/longitudinal magneto-optical Kerr effects (MOKE), this instrument rapidly and globally detects the magnetism of wafer films. Non-contact measurement avoids wafer damage and is suitable for post-patterning sample testing in spin chip......
Truth Instruments Co., Ltd.

Address: 169 Zhuzhou Road, Laoshan District, Qingdao, Shandong Province, China

MXC4005XC Sensor IC Monolithic and Wafer Level Packaged Three-Axis Accelerometer with I2C Digital Output in 1.18mm×1.70mm×0.85mm WLP-6

China MXC4005XC Sensor IC Monolithic and Wafer Level Packaged Three-Axis Accelerometer with I2C Digital Output in 1.18mm×1.70mm×0.85mm WLP-6 on sale
MXC4005 Sensor IC Monolithic And Wafer Level Packaged Three-Axis Accelerometer WLP-6 Product Overview Of MXC4005 The MXC4005 is a monolithic and wafer level packaged three-axis accelerometer featuring the smallest profile of 1.18mm×1.70mm×0.85mm, making......
ShenZhen Mingjiada Electronics Co.,Ltd.

Address: 1239 New Asia Guoli Building Zhenzhong Road.,Futian district Shenzhen China

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Products: MXC4005XC Sensor IC Monolithic and Wafer Level Packaged Three-Axis Accelerometer with I2C Digital Output in 1.18mm×1.70mm×0.85mm WLP-6

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