Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED
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...a heat conducting product in the shape of paste.They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficiency is far superior to that offered by others....
Dongguan Ziitek Electronical Material and Technology Ltd.
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Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling
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...filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®035-05 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration,...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
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... paste gel One-part pre-curing type Silicone thermal conductivity complex Product Features: High thermal conductivity 4W/m∙K Very small BLT and very low thermal resistance Soft adhesion and self-adhesive properties after dispensing Excellent chemical and...
Shanghai Huitian New Material Co., Ltd
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TIF060-16 Purple Silicone Thermal Gel For CPU
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...Thermal Gel For CPU Prodcuts description TIF®060-16 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®060-16 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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High Conductivity 6W/MK Silicone Resin Thermal Gel DFor CPU GPU
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...-performance devices will emit more heat when working, so how to control the temperature to ensure that the high-speed operation of electronic devices is crucial. When the traditional thermal gap material can...
Trumony Aluminum Limited
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Conductivity Thermal Interface Materials Pink Thermal Gel One Part 9.1 W/mK
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...thermal performance of liquid gap filler. It is one-part dispensable gap filler, ready-to-use, not requiring any curing operation. Tputty™ 910 is a soft, compliant, high thermal conductivity dispensable gap filler providing lowest thermal resistance and...
ZSUN CHIPS CO., LTD
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DNA / RNA Gel Electrophoresis Power Supply Dual Core Microprocessor
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JY600C Technical Specifications: Type of Output: Constant-Voltage, Current or Power Increment: 1V, 1mA, 1W Output Range: 10--600V, 1--500mA, 1--300W. Timer Range: 1min~99hr, 59min Display: LCD display with backlight Output jacks: Four sets of output jacks ......
Beijing JUNYI Electrophoresis Co., Ltd.
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Inorganic Thermal Insulation Glazed Hollow Beads Expand Dry Mortar Mixing Plant
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..., according to the ordinary horizontal putty powder mixer improved, equipped with secondary lifting equipment, product silo, valve automatic measurement packaging machine,to achieve the automatic measurement of putty powder packaging, saving the cost of...
Henan Mind Machinery Equipment Co., Ltd.
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Low Noise Overspeed PRP PRF Centrifuge TD-24K Microprocessor Control For Blood Type Card
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...Microprocessor Control For Blood Type Card TD-24K blood gel card centrifuge is desinged by our technicians who adopt foreign advanced technology of similar products. It is widely used in blood serology, conventional test of blood type, erythrocyte washing, micro-column gel immunoassay and son on. It has signification in clinical trials and analysis. Product Advantages 1. Microprocessor......
Hunan Xiangyi Laboratory Instrument Development Co., Ltd.
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Shin-Etsu X-23-7783D High-Performance Thermal Grease - Advanced TIM for Microprocessor Cooling
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...Thermal Grease - Advanced TIM for Microprocessor Cooling Basic Product Attributes Shin-Etsu X-23-7783D is a gray, high-viscosity thermal grease designed for cooling high-performance microprocessors, with thermal conductivity up to 6 W/mK (solvent-free) and 2% solvent content for screen-printing compatibility. Product Description Developed by Shin-Etsu Chemical, X-23-7783D thermal......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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