1.0mmt Soft Compressible Gap Pad Thermal Conductivity For Memory Modules
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...Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. TIF100-30-02US-Datasheet-REV02.pdf Features > Good thermal...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Ultra Soft Gap Pad Thermal Conductivity 12±5 Shore00 For Display Card
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...thermal conductive gap pad 2.0 g/cm3 , Continuos Use Temp :-40to 160℃ for CD-Rom, DVD-Rom cooling Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF100-05ES-Datasheet.pdf TIF1160-05ES is an extremely soft gap...
Dongguan Ziitek Electronical Material and Technology Ltd.
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AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity
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Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 Hardness (Shore OO) 20±5 ......
Shenzhen Aochuan Technology Co., Ltd
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TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module
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...applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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BERGQUIST GP3000S30 Battery Pack Gap Filled Thermally Conductive Silicon Pad 3.0W/M-K
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...Gap filled Thermally Conductive silicon Pad 3.0W/m-k Product description : BERGQUIST GP3000S30 Soft thermal conductive material with substrate gap filling. Also known as GAP PAD 3000S30. The new model is GAP PAD TGP 3000. Product Features : Under very low pressure, low S-Series thermal......
SZ PUFENG PACKING MATERIAL LIMITED
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Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
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... of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
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Flexible Soft Thermal Pad Thermal Conductive Silicone Pad ISO
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...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal conductivity......
Shenzhen Antac Technology Limited
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Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
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... deflection characteristics. The combination will allow minimal stress oncomponents while also yielding low thermal resistance. As a result, less mechanical and thermalstresses will be experienced within your device. Tflex™ HD700PI can be provided with...
ZSUN CHIPS CO., LTD
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Best Quality High Thermal Conductivity GPU CPU Thermal Gap Pads
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...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal......
Trumony Aluminum Limited
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Low Density Thermally Conductive Gap Filler Dowsil TC5515LT
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...thermally conductive silicone gap filler designed for efficient heat dissipation in electronic devices and electric vehicle (EV) modules. With a thermal conductivity of 2.0 W/m·K and a cured specific gravity of 1.95, this material offers a reliable solution for thermal......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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