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Ic Package Substrate With Cap Plated

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ic package substrate with cap plated

from 3 Products

BGA IC Package Substrate With Cap Plated MGC BT material

Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ......

HongRuiXing (Hubei) Electronics Co.,Ltd.

Address: Tianyue building 711,518100 shajing centre bao'an district Shenzhen city

2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

... annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF Plate thickness: 0.15mm, Panasonic material PIGL042504......

Shenzhen Chaosheng Electronic Technology Co.,Ltd

Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

Straight Pins Opto Electronic Metal TO46 Package Header

Product model: TO-46 Product name: Suitable Coining Round Styles Pedestal Leads Are Perpendicular To The Substrate Mounting Surface Finish: Fully plating Au.(Finish could adopt fully plating or selective plating.) Plating coating: Bottom plate, lead ......

JOPTEC LASER CO., LTD

Address: No.451 Huangshan Road, Hefei, Anhui, China

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Your subject must be between 10-255 characters!
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