eMMC IC Package Substrate PCB
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                                            ...IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC assembly,Storage IC......                                         
                                            HongRuiXing (Hubei) Electronics Co.,Ltd.
                                         
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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                                            2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......                                         
                                            Shenzhen Chaosheng Electronic Technology Co.,Ltd
                                         
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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                                            ...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......                                         
                                            JIMA Copper
                                         
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99% Al2O3 Alumina Ceramic Plate Substrates size Customized
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                                            Alumina Ceramic Plate, Al2O3 Ceramic Plate, Alumina Ceramic substrates 99% al2o3 heater Sheets Plates Material properties datasheet Al2O3 ZrO2/Y2O3 ZrO2/MgO MgO SiC Si3N4 Reaction sintered Si3N4 Hot pressed Physical properties Density (g/cm3) 3.9 5.9 5.75......                                         
                                            Dongguan Ming Rui Ceramic Technology Co.,ltd
                                         
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SGS Printing Self Adhesive Packaging Labels Size Customized
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                                            ...adhesive packaging labels Material MOPP/VMPET/PE Feature & safety 1. Safety Food Grade Material & Ink, Eco-friendly packaging 2. High temperature, freezer & pressure resistance Custom order Accept Colors Up to 10 colors or with printing Size Customized ......                                         
                                            Shenzhen Hangte Technology Development Co.,Ltd
                                         
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Aluminum Mirror Coating for Beauty/Jewelry Packaging Substrate SGS Certified Width From 300mm to 1500mm Customizable
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                                            ...customized Thickness 33 mic or customized Paper core 1 inch, 3 inch Material BOPP/PET base film+water-based varnish Color Silver/Gold ......                                         
                                            NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
                                         
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Sic Optical Lens 10x10x10mmt 4H-SEMI HPSI Shape And Size Customized 6SP Thickness 10.05
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                                            Abstract of Sic optical lens Sic optical lens 10x10x10mmt 4H-SEMI HPSI shape and size customized 6SP Thickness 10.05 ZMSH offers high-performance silicon carbide (SiC) optical lenses with a standard size of 10×10×10mm, while also supporting customized ......                                         
                                            SHANGHAI FAMOUS TRADE CO.,LTD
                                         
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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                                            Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......                                         
                                            Shenzhen Tecircuit Electronics Limited
                                         
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Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping
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                                            Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping Need packaging that integrates into your existing process? Our JEDEC trays are automation-ready and tailor-made for your workflow. This JEDEC matrix tray is specially designed to ......                                         
                                            Shenzhen Hiner Technology Co., Ltd.
                                         
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Heat Dissipation Metallized Ceramic Substrates , Ceramic Wafer Size Customized
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                                            Heat Dissipation Aluminum Nitride Metallized Ceramic CoB Wafer Specification of ceramic metallised substrate: 1. Available material: Alumina(Al2O3), Aluminum nitride (AlN) and Beryllia (BeO) 2. Size capability: min. size to be 1mm x 1mm, max. size to be ......                                         
                                            Jinghui Industry Limited
                                         
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