BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
|
...Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications (0.3mmt for 1-2-1) Applicable environmentally-friendly products (Halogen-free, Lead-free) ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
|
High Power Bi Color 300W 6060 Flip Chip Custom Cob Led Chip For Commerical Led Light Stage Light
|
...CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate ......
Shenzhen Learnew Optoelectronics Technology Co., Ltd.
|
SiC Ceramic Vacuum Chuck Flip-Chip Bonding Mirror Polishing High-Stiffness
|
SiC Ceramic Vacuum Chuck Abstract SiC Ceramic Vacuum Chuck Flip-Chip Bonding Mirror Polishing High-Stiffness A Flip-Chip Bonding Vacuum Chuck is a high-precision vacuum adsorption component specifically designed for Flip-Chip Bonding processes in ......
SHANGHAI FAMOUS TRADE CO.,LTD
|
Color Temperature Range Options 2700K-6500K Flip Chip Cob Led in Aluminum Package Material
|
Product Description: Introducing our innovative Flip Chip Cob Led, a high power COB LED that sets a new standard in illumination technology. This cutting-edge product features advanced design and superior performance, making it the ideal choice for a wide ......
Shenzhen Tongyifang Optoelectronic Technology Co., Ltd.
|
300mA 3W 5W 10W 120lm Flip Chip COB LED
|
...Flip chip US Bridgelux 3 Years Warranty LED COB Chip 110-120lm/W CE ROHS Certificate Product Description Produce Name DL-20/11 Led cob chip Watts 3w Current 300mA Voltage 9-10v CRI 70 Lumens 110-120lm/W Chip Brand US Bridgelux Life Span 50000 hours Color Temperature 2700k / 3000K / 4000k / 6000K Specification ◆Mechanical Dimensions: R20.0x1.7(mm) ◆Package Structure:Aluminium Base Chip......
Shenzhen Xuancai Electronic Co., Ltd
|
RGBW Led Light Module High Power 250W Cree Flip-chip LED Emitters
|
... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower Forward Current result in Lower heat-emission to...
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
|
Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support
|
Advanced Flux Jetting Dispenser for Warped Chip Flux Support The GS600 series is a next-generation inline flux jetting system designed to solve one of the most demanding challenges in semiconductor assembly: flux application on highly warped chips mounted......
Changzhou Mingseal Robot Technology Co., Ltd.
|
Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine
|
Fully Automatic Smt Production Line Flip Chip Die Bonder Machine For COB Strip Light and Semiconductor Packaging Chip Mounting Electronics Machinery High-Speed Flexible Strip Die Bonder Product Features 1. Utilizes a sheet-to-sheet docking station with ......
Shenzhen Hongxinteng Technology Co., Ltd.
|
Flip Chip High Lumen Led Flood Light COB Cool White Outdoor Ip65 Waterproof 150w
|
...Flip Chip COB Cool White outdoor ip65 waterproof 150w led flood light with 107LM/W Product description 1. Basic information for LED Flood Light: Product name:10w led flood light Input Voltage:100-240v AC IP Grade:IP65 LED Qty:1 pcs 2. LED Chip for LED Flood Light: Import USA LED Bidgelux 45mil Chip/28mil Epistar chip ,lumens up to 90lm/w High brightness and low light decay Stable color temperature, long lifespan, best package...
Shenzhen Leyond Lighting Co.,Ltd.
|
SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon
|
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (......
Unicomp Technology
|