ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
                                         
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                                            Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/......                                         
                                        
                                            HongRuiXing (Hubei) Electronics Co.,Ltd.
                                         
                                        
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
                                         
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                                            2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......                                         
                                        
                                            Shenzhen Chaosheng Electronic Technology Co.,Ltd
                                         
                                        
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Iphone IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip
                                         
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                                            ...BGA Package IC Chip Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip - Power Management Circuit, BGA Package. Specification Of APL1096/343S00474 Part Number: APL1096/343S00474 Package: BGA Category: Iphone IC Chip Mounting Type: Surface Mount Product Photo Of APL1096/343S00474 Other Electronic Components In Stock Part Number Package PPC405EXR-NPD333T BGA......                                         
                                        
                                            ShenZhen Mingjiada Electronics Co.,Ltd.
                                         
                                        
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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources
                                         
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                                            ...BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package......                                         
                                        
                                            Shenzhen Sai Collie Technology Co., Ltd.
                                         
                                        
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Multilayer Rigid Flex Black Fr4 HDI Board PCB BGA Package Manufacturing Service
                                         
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                                            Black Multilayer Board HDI PCB BGA Package PCB Manufacturing Service ♦ What is HDI PCB? HDI PCB uses micro blind/buried vias and build-up technology to create high-......                                         
                                        
                                            DQS Electronic Co., Limited
                                         
                                        
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
                                         
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                                            ... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......                                         
                                        
                                            NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
                                         
                                        
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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm
                                         
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                                            BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build Technical Requirement for turnkey pcb ......                                         
                                        
                                            Chengdu Cesgate Technology Co., Ltd
                                         
                                        
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
                                         
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                                            ...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......                                         
                                        
                                            JIMA Copper
                                         
                                        
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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
                                         
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                                            3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich ......                                         
                                        
                                            Dongguan Ziitek Electronical Material and Technology Ltd.
                                         
                                        
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LTM4622IY 4A 20V Synchronous Step-Down µModule Regulator with 95% Efficiency 3.1-20V Input ±1.5% Output Accuracy 2.5MHz Switching and 6.25mm × 6.25mm BGA Package
                                         
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                                            LTM4622IY 4A 20V Synchronous Step-Down µModule Regulator with 95% Efficiency 3.1-20V Input ±1.5% Output Accuracy 2.5MHz Switching and 6.25mm × 6.25mm BGA Package FEATURES n Complete Solution in <1cm2 n Wide Input Voltage Range: 3.6V to 20V n 3.3V Input ......                                         
                                        
                                            TOP Electronic Industry Co., Ltd.
                                         
                                        
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