Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler
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Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting...
Dongguan Ziitek Electronical Material and Technology Ltd.
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Naturally Tacky 6.5W Ultra Soft Thermal Conductive Gap Filler Pad For LED CPU GPU EV Battery
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...Thermal Conductive Gap Filler Pad For LED CPU GPU EV Battery TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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AOK Multipurpose Thermal Conductive Gap Filler For Networking
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...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m...
Shenzhen Aochuan Technology Co., Ltd
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Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler
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..., thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Dowsil TC-4525 Thermally Conductive Gap Filler 2.5W/m·K for Automotive
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Dowsil TC-4525 Thermally Conductive Gap Filler for Automotive Electronics Cooling Product Attributes Dowsil TC-4525 is a two-part, room temperature cure silicone gap filler with thermal conductivity of 2.5 W/m·K, low compression stress, and controlled ......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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Grey Thermally Conductive Gap Filler Pads Electronic Thermal Gap Pad Material
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Thermal Pad Gap Filler Laird Tflex SF10 10 W/Mk Thermal Conductivity Die Cutting...
ZSUN CHIPS CO., LTD
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Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
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... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...
SZ PUFENG PACKING MATERIAL LIMITED
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Thermal Conductive Gap , Thermally Conductive Material Filler Electric Thermal Interface Pads
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...thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. A-gaphite 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24”...
Adcol Electronics (Guangzhou) Co., Ltd.
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5270 Two Component Thermal Gel Gap Filler Low Viscosity And Good Workability Able To Cure At Room Temperature
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5270 TDS-EN.pdf 5270 is a two-component silicone thermal conductive gel, which has high thermal conductivity and low density Product Description Silicone thermal conductive two-component gel Low transient/static stress Two-part 1: 1 mix Product Features: ......
Shanghai Huitian New Material Co., Ltd
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High Performance One Component Thermal Gap Filler for PCB CPU
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... with thermally conductive filler, stirred, mixed and encapsulated. It adopts dispensing design, when used with the glue mixing nozzle hit, easy to use and fast, can achieve automatic dispensing production. Thermally conductive gel is divided into one...
Trumony Aluminum Limited
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