Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient
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... Pressure Control Precision Pressure Control Cycle Time Short Key Features Descriptions Fully Automatic Molding System This molding equipment is...
Guangdong Taijin Semiconductor Technology Co., Ltd
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100KV Semiconductor Inspection Equipment CSP LED PCB X Ray Machine
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CSP LED X Ray Machine Closed Tube Flip Chip S7000 For 100KV Semiconductor Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace ......
Shenzhen Wisdomshow Technology Co.,ltd
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High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine
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Semiconductor Packaging Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Product name die bonding machine Solid crystal cycle >40 ms Die bonding position accuracy ±0.3 mil Dispensing heating constant temperature Resolution 0.5 um Chip......
Shenzhen Wenzhan Electronic Technology Co., Ltd.
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OEM Black Waffle Pack Chip Trays Match Automation Equipment
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OEM Black Waffle Pack Chip Trays Match Automation Equipment Waffle Pack Series Products Can Match Automation Equipment Waffle pack is widely used in semiconductor, photoelectric industry customers of the product requires a high degree of cleanliness and ......
Shenzhen Hiner Technology Co., Ltd.
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DAC8412FPC Quad Integrated Circuit Chip , integrated semiconductor programmed integrated
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DAC8412FPC Quad, 12-Bit DAC Voltage Output with Readback integrated semiconductor programmed integrated FEATURES +5 V to 15 V Operation Unipolar or Bipolar Operation True Voltage Output Double-Buffered Inputs Reset to Min (DAC8413) or Center Scale (DAC8412......
Anterwell Technology Ltd.
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DAC8412FPC Quad Integrated Circuit Chip , integrated semiconductor programmed integrated
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DAC8412FPC Quad, 12-Bit DAC Voltage Output with Readback integrated semiconductor programmed integrated FEATURES +5 V to 15 V Operation Unipolar or Bipolar Operation True Voltage Output Double-Buffered Inputs Reset to Min (DAC8413) or Center Scale (DAC8412......
ChongMing Group (HK) Int'l Co., Ltd
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Al-tera Ep4ce22e22c8n Electronic Components Semiconductor Manufacturing Equipment Microcontroller Chip ic chips EP4CE22E22C8N
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ShenZhen QingFengYuan Technology Co.,Ltd.
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ASIC Chip sealant dispensing machine Inline Visual Encapsulation Dispensing Machine
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...Chip Sealing Inline Visual Encapsulation Dispensing Machine In advanced semiconductor manufacturing, sealing and protecting ASIC (Application-Specific Integrated Circuit) chips require precise, reliable, and highly controlled adhesive dispensing. The Mingseal GS600 Series Inline Visual Encapsulation Dispensing Machine is purpose-built to meet these demands for chip......
Changzhou Mingseal Robot Technology Co., Ltd.
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Precision Glass Encapsulated NTC Thermistor Suppliers Easy Automatic Installation
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...equipped with tinned axial leads and then wrapped with purified glass. Features: • Stability, high reliability • Resistance range: 0.3 ~ 4000KΩ • High resistance ......
Hefei Minsing Automotive Electronic Co., Ltd.
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300 Deg 4300 Glass Encapsulated NTC Thermistor 10mW MF59 NTC 100K 3950
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...Encapsulated NTC Thermistors MF59 100K 4300 220C A Overview Of The Glass Encapsulated NTC Thermistors MF59 Glass encapsulated series precision NTC Thermistor for temperature measurement and control is made by ceramic material combined with semiconductor chips......
Dongguan Ampfort Electronics Co., Ltd.
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