MCP package Substrate 0.5oz Copper Customize BT Material
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MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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BT IC BES2600YP Ultra Low Power BT Audio SoC BGA Package Dual Mode BT 5.3 Chip
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... of BT+Noise Reduction+In Ear Detection. It supports dual mode BT 5.3 and multipoint connection. Specification Of BES2600YP Part Number: BES2600YP Package: BGA Type: Ultra Low Power BT Audio SoC Subsystem: Sensor Hub Subsystem Functions: Voice Wake-up And...
ShenZhen Mingjiada Electronics Co.,Ltd.
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NOKIA ASIM 475765A 5G Airscale BTS
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..., ion-implanted substrates, and lightly doped source and drain regions. All regions of transistor operation can be simulated using ASIM including the triode, saturation and subthreshold ......
Changsha Xingheda Technology Co., Ltd
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Black Solder Mask IC Substrate PCB 0.2mm RoHS Compliant For Electronic Devices BT materials SD card
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2-Layer Rigid IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {......
LT CIRCUIT CO.,LTD.
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Optical Communication Packaging Aluminum Nitride Ceramic Substrate
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Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT......
Wuxi Special Ceramic Electrical Co.,Ltd
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MCP 2.8 Series Automotive Electrical Connectors
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... This part come with the following types: Series:MCP 2.8 Series Product:Terminals Accessory Type:Flat type recepatacle Mounting Style:Free Hanging Termination Style:Crimp Packaging:Cut Tape Packaging:Reel Contact Type:Socket (Female) Current Rating:......
Xi'An YingBao Auto Parts Co.,Ltd
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