BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
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FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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NOKIA ASIM 475765A 5G Airscale BTS
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..., ion-implanted substrates, and lightly doped source and drain regions. All regions of transistor operation can be simulated using ASIM including the triode, saturation and subthreshold ......
Changsha Xingheda Technology Co., Ltd
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Black Solder Mask IC Substrate PCB 0.2mm RoHS Compliant For Electronic Devices BT materials SD card
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2-Layer Rigid IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {......
LT CIRCUIT CO.,LTD.
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6 Layer Multilayer PCB Red Solder Mask White Silk Screen For Ultrasonic Wave
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... RO4350, Rogers RO4003 Polyimide Teflon Black FR-4 Arlon AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core Board...
Shenzhen Xinchenger Electronic Co.,Ltd
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