L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold
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Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Wire Bonding 2 Layer PCB FR4 Printed Circuit Board
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...Wire Bonding Main Features: 1 2 Layer FR4 substrate material printed circuit board. 2 Double layer copper, copper thickness is 35um/35um. 3 Finished pcb thickness is 1.6mm. 4 PCB with wire bonding. 5 Immersion Gold treatment 6 2 layer pcb with 4/4mil min line......
Witgain Technology Limited
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LCD Panel Wire Bonding Machine Pulse Heating 1500W AC220V 50Hz Multi Line Black Screen
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...Bonding Machine to Repair TV Product Description LCD Panel Repair Machine can refurbish vertical, horizontal, vertical, horizontal, black belt, the black line, the color line, ribbons, multi-line, flower screen, black screen, white show, horizontal, vertical half and half, fault, and so on,caused by FPC/TAB/COF.Suitable for TFT panel and TAB, FPC and LCD or PCB board combination bonding Wire Bonding...
Guangzhou Chuang Li You Machinery Equipment Technology Co., Ltd
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7070 SMD Natural White 30V 9W LED CHIP Gold Wire EMC Substrate SMD LED
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...Wire EMC Substrate SMD LED Key Features 1.Specifications: 7070 package, 9W power, 30V voltage. 2.Light Color: 4500K neutral white. 3.Materials: EMC bracket, gold wire bonding. 4.Advantages: High reliability, long lifespan. Product Specifications Attribute Value Type High Voltage 7070 SMD LED CHIP Color 4500K Power 9W Substrate......
Shenzhen Huanyu Dream Technology Co., Ltd
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200W Wire Bonding Machine Semi-Automatic Soldering Machine for USB Data Line Light Point Pcb Board Line Point Solder Machine
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... Wire Bonding Machine Semi-Automatic Soldering Machine for USB Data Line Light Point Pcb Board Line Point Solder Machine High - efficiency operation: It is equipped with an automatic tin - feeding device, which can automatically transport the tin wire to ......
Shenzhen Zhongtu Automation Technology Co., Ltd.
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Servo Positioning Full Auto Chip Filling Antenna Wire Bonding Machine For Smart Card
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Servo Positioning Full Auto Chip Filling Antenna Wire Bonding Machine For Smart Card Feature: The full auto bonding machine use to weld the antenna and modules of contactless cards. With the double pulse current inverter welding, the machine is steady. The......
Wuhan Jia Qirui Card Technology Co., Limited
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18650 battery aluminium wire bonding machine best price automatic wire bonder for battery pack production line
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High Quality Automatic ultrasonic wire bonder for battery pack Equipment basic working principle: After the module assembly process is completed, the equipment is used to automatically load the system, and then sent to the welding area through the ......
Shenzhen Onetop Technology Co.,Ltd
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High Accuracy Fill Dispenser Machine Dual Valve Dam Fill Dispenser For Wire Bonding
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...Wire Bonding The GS600DD is an advanced dual-valve dispensing solution crafted for the modern semiconductor packaging industry. Designed as a robust cabinet-style floor-standing unit, this system provides manufacturers with the flexibility, speed, and high accuracy demanded by today’s PCBA and high-end semiconductor assembly lines......
Changzhou Mingseal Robot Technology Co., Ltd.
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High Capacity 90kg/ Hour Wire Mesh PVC Coating Line Wire Size From1.0--6.0mm
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PVC Wire Coated/Coating Making Machine (wire size from1.0--6.0mm) 1. PVC wre coating making machine description: Machine is fully automatic machine that could produce PVC coating on Nail Wire or Galvanized Wire. The machine is able to produce PVC Coating ......
Hebei Oulite Import&Export Trading Co.,Ltd
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2 Layer Prototype Circuit Board FR4 TG 135 Blue Soldermask 35um Copper HASL Lead Free
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...35um Copper HASL Lead Free Linked Electronics Co., Limited is a PCB manufacture in China which focusing on PCB prototypes, high mix PCB production, aluminum PCB and quick turn PCB board. The substrate most commonly used in printed circuit boards is a glass fiber reinforced (fiberglass) epoxy resin, that is FR4 material, with a copper foil bonded......
Linked Electronics Co., Limited
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