1.5mmt Cpu Thermal Pad High Tack Surface Reduces Contact Resistance For It Infrastructure
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                                            ...5mmT thermal pad High tack surface reduces contact resistance for IT infrastructure Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal......                                         
                                            Dongguan Ziitek Electronical Material and Technology Ltd.
                                         
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TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu Cpu Thermal Pad
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                                            TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu Cpu Thermal Pad Product descriptions TIF®700PUS Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins......                                         
                                            CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
                                         
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Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules
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                                            Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Thermally......                                         
                                            Dongguan Ziitek Electronic Materials & Technology Ltd.
                                         
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Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
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                                            ...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) >6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...                                         
                                            Shenzhen Aochuan Technology Co., Ltd
                                         
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High Volume Resistivity Custom CPU Thermal Pad with Options Density 3.0±0.5 G/cm3
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                                            Product Description: With an operating temperature range of -40°C to 200°C, this Silicone Thermal Pad can easily handle extreme temperatures, making it a perfect choice for use in high-temperature applications. Its continuous use temperature range of -40......                                         
                                            Shenzhen Antac Technology Limited
                                         
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Coated Paper Hang Tab Box Packaging For Silicone CPU Thermal Pads SIM CARD
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                                            #detail_decorate_root .magic-0{border-bottom-style:solid;border-bottom-color:#53647a;font-family:Roboto;font-size:24px;color:#53647a;font-style:normal;border-bottom-width:2px;padding-top:8px;padding-bottom:4px}#detail_decorate_root .magic-1{width:750px;......                                         
                                            Shenzhen Senwi Printing & Packaging Co., Ltd.
                                         
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Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
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                                            ... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...                                         
                                            SZ PUFENG PACKING MATERIAL LIMITED
                                         
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Best Quality High Thermal Conductivity GPU CPU Thermal Gap Pads
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                                            ...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal......                                         
                                            Trumony Aluminum Limited
                                         
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3W/MK Soft Silicone Thermal Pad Insulating Sheet for Computer CPU GPU Chip Heat Sink Heatsink Cooling Thermal Conductive Pad
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                                            Product Description: Our Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensile strength of 3 MPa, this Thermal Heat Sink ......                                         
                                            Shenzhen Linmao Electronic Material Co.,Ltd.
                                         
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Odm Metal Stamping Parts Laptop Gpu Cpu Vga Chip Ram Heatsink Sheet 1.2kg Thermal Pad
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                                            Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad Material Aluminum Alloy,Steel or Customized Color Customized MOQ 1pc Sample Acceptable Certification CE, RoHS, GS, ISO9001 Inspection 100% inspection Tolerance +/-0.1mm ......                                         
                                            Nanpi Xinchengweiye Hardware Products Co., Ltd.
                                         
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