Thermal Management 1.5W/MK Thermal Gap Pad With Excellent Adhesion To Rough Surfaces
|
Thermal Management 1.5W/MK Thermal Gap Pad With Excellent Adhesion To Rough Surfaces Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
94 V0 1.25W/MK Thermal Gap Pad 0.25-5.0mmT For High Speed Mass Storage Drives
|
... interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well...
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Thermal Interface Pad Thermal Conductive Rubber , Thermal Conductive Material
|
... are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. A-gaphite 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm)...
Adcol Electronics (Guangzhou) Co., Ltd.
|
7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
|
2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
|
High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
|
High Thermal Conductivity Pad Gap Filler Silicone Tflex HD90000 Laird Thermal Conductivity 7.5 W/Mk Product Description Tflex HD90000 combines 7.5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will ......
ZSUN CHIPS CO., LTD
|
TIF100-01ES Self-Adhesive Thermal Gap Pad 6.0W/M·K Silicone Thermal Pad
|
...Thermal Gap Pad 6.0W/M·K Silicone Thermal Pad Product descriptions TlFTM100-07S Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductivity 1.5W/mK......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
10.0mm Thick Silicon Heat Conductive Material 400 centigrade 0.8W/mk
|
High Heat Conductive Silicon These heat conductive silicon products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface ......
Boalv New Material Technology Co., Ltd.
|
Submit your “3 0 w mk thermal interface pad” inquiry in a minute :