2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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                                            2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF Plate thickness: 0.15mm, Panasonic......                                         
                                            Shenzhen Chaosheng Electronic Technology Co.,Ltd
                                         
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0.15mm Thickness 2 Layers IC Package Substrate For memory package
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                                            ... card,USB,Chip substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.32mm; ......                                         
                                            HongRuiXing (Hubei) Electronics Co.,Ltd.
                                         
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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                                            ...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......                                         
                                            JIMA Copper
                                         
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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                                            Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......                                         
                                            Shenzhen Tecircuit Electronics Limited
                                         
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Slip Layer Board , Low Humidity Electronics Industry Dry Box Led Display For Semiconductors, IC packages
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                                            Slip Layer Board , Low Humidity Electronics Industry Dry Box Led Display Applications: Its typical applications include the prevention and protection against all types of oxidation (rust), the prevention of the growth of fungus on optics, the dry ......                                         
                                            SUPER SECURITY LTD
                                         
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Faceted Sapphire Substrate with Visible Natural Inclusions for Optoelectronic Devices
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                                            ...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along...                                         
                                            ARH Sapphire Co., Ltd
                                         
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Black Solder Mask IC Substrate PCB 0.2mm RoHS Compliant For Electronic Devices BT materials SD card
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                                            2-Layer Rigid IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: ......                                         
                                            LT CIRCUIT CO.,LTD.
                                         
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DP83869HMRGZT Integrated Circuit IC Chip High Immunity Ethernet Physical Layer
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                                            ... 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.15V ~ 3.45V Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 48-VFQFN Exposed Pad Supplier Device Package 48-VQFN (7x7) Features •...                                         
                                            Shenzhen Sai Collie Technology Co., Ltd.
                                         
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Food Grade Tin Plated Steel Sheet For Packaging Metal Tinplate Boxes Tin Can And Tinplate Food Can TINPLATE SPTE/ TFS
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                                            ... of tin plated on the surface of a low-carbon steel substrate by electroplating. It is mainly composed of a steel substrate, a tin layer and an alloy layer between the two. 2,Manufacturing process: It includes pickling, cold rolling, electrolytic cleaning,...                                         
                                            SHANGHAI QUANYE METAL PACKAGING MATERIALS CO.,LTD
                                         
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Emulsion Explosive 0.26mm 260 Micron Polyethylene Packaging Film
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                                            ...Packaging Film For Emulsion Explosive Packaging Product Description: It is a high-strength multi-layer composite film,It is made of HDPE as the base material, adding plasticizer, plasticizer, stabilizer, antioxidant, UV absorber, toughener and other additives through multi-layer co-extrusion blow molding into embryos, and then by multiple pull Stretching, then rotary cutting into a film substrate......                                         
                                            Upass Material Technology (Shanghai) Co.,Ltd.
                                         
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