Home > Machinery > Paper Production Machinery > Paper Product Making Machinery >

1mil Accuracy Flip Chip Die Bonder Machine

1-10 Results for

1mil accuracy flip chip die bonder machine

from 4 Products

ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

...Flip Chip Die Bonder Machine Original And Used ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder......

INFINITE AUTOMATION CO ., LIMITED

Address: Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China

Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

Machine Features ● Front-loading and rear-loading methods, compatible with a docking station, facilitate operator operation and connection, improving production cycle time; ● Utilizes internationally leading dual die bonding, dual dispensing, and dual ......

Shenzhen Hongxinteng Technology Co., Ltd.

Address: Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.

High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine

.../high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Product name die bonding machine Solid crystal cycle >40 ms Die bonding position accuracy ±0.3 mil Dispensing heating constant temperature Resolution 0.5 um Chip ring size 6 ......

Shenzhen Wenzhan Electronic Technology Co., Ltd.

Address: 301A, Bldg. D, No. 50, Nanhuan Road, Shiwei Community, Matian Street, Guangming Dist., Shenzhen, Guangdong, China

Multilayer IC Bonding Machine 0.250.25mm-1010mm Die Bonder Equipment

...Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. Features: Multilayer Capability System-in-Package Capability Ultrathin Die Bonding Technology Supermini Chip......

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Address: Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China

Submit your “1mil accuracy flip chip die bonder machine” inquiry in a minute :

*From:	Your email address is incorrect!
To:	Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd Products: Multilayer IC Bonding Machine 0.250.25mm-1010mm Die Bonder Equipment
*Subject:	Your subject must be between 10-255 characters!
*Message:	For the best results, we recommend including the following details: --Self introduction --Required specifications --Inquire about price/MOQ Your message must be between 20-3,000 characters!
	Please reply me within 24 hours. Yes! I would like your verified suppliers matching service! Yes! If this supplier doesn't contact me in 3 days, I want everychina.com to recommend me more suppliers.

Submit “1mil accuracy flip chip die bonder machine” inquiry

*From:
Your email address is incorrect!
To: INFINITE AUTOMATION CO ., LIMITED
*Subject:
Your subject must be between 10-255 characters!
*Message:
For the best results, we recommend including the following details: --Self introduction --Required specifications --Inquire about price/MOQ Your message must be between 20-3,000
Yes! I would like your verified suppliers matching service!

Inquiry Cart 0