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| Categories | Rigid‑Flex PCB |
|---|---|
| Model Number: | Rigid‑Flex PCB |
| Applications: | Wearables, aerospace, medical devices, consumer electronics |
| Layer Count: | 2 to 20+ layers |
| MOQ: | 1PCS |
| Delivery Time: | 5‑15 work days, urgent order available |
| Surface Finish Options: | ENEPIG, Hard Gold (30-50µin), ENIG |
| Electrical Performance: | Low signal loss, high reliability |
| Price: | Negotiable |
| Flexibility: | High; allows bending and folding |
| Certification: | ISO9001 |
| Minimum Trace Width: | As low as 3 mil (0.075mm) |
| Supply Ability: | 20000 Square Meters |
| Material: | Combination of rigid and flexible substrates |
| Minimum Trace Spacing: | As low as 3 mil (0.075mm) |
| Brand Name: | JQPCB |
| Cost: | Higher than standard rigid or flexible PCBs due to complexity |
| Packaging Details: | Vacuum packing + Anti‑static bag, Desiccant, Temperature indicator card, Carton box |
| Place of Origin: | China |
| Layer Configuration: | 4 – 12 layers |
| Flex Layers: | Polyimide or polyester film |
| Surface Finish: | HASL, ENIG, OSP, Immersion Silver, etc. |
| Payment Terms: | T/T,D/P,D/A,L/C |
| Flex Material: | Polyimide (PI / Kapton) with RA Copper |
| Rigid Layers: | FR4 or other rigid materials |
| Via Type: | Through-hole, blind, buried, microvias |
| Company Info. |
| Shenzhen Jiaqing Circuit Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Rigid‑Flex PCB (R‑FPCB) is an integrated circuit board combining rigid FR‑4 sections and flexible PI polyimide segments within one single panel. Rigid areas provide stable platforms for component soldering and assembly, while flexible PI portions enable repeated bending, folding and twisting during product operation. Different from ordinary rigid PCBs or pure FPC flexible circuits, rigid‑flex boards eliminate welding connectors between rigid and flexible parts, reducing assembly complexity and potential connection failure risks. It is widely applied for wearable electronics, portable smart devices, medical equipment, aerospace modules and compact embedded electronic systems.
Key Process Features
Hybrid base material structure: Rigid FR4 layers are laminated with
PI flexible layers under precise lamination parameters to guarantee
stable inter‑layer bonding. Different layer combinations such as
FR4 4L + FLEX 2L or FR4 4L + FLEX 4L are customizable according to
project requirements. Multiple surface finish options including
immersion gold, HASL and OSP are available to optimize
solderability, anti‑oxidation and contact reliability.
Manufacturing methods: Rigid‑flex PCB adopts selective cover‑layer opening, precise layer alignment and segment‑by‑segment routing technologies. Special depth‑controlled routing is applied to separate rigid and flexible zones without damaging inner circuit traces. Flexible areas keep proper bending radius to avoid copper trace cracking under cyclic bending.
Dimensional constraints: Minimum trace / space, bending radius, flexible region thickness and outline tolerance shall comply with manufacturability rules. Sharp corners on flexible zones must be rounded. Keep proper clearance between bending zones and component pads to prevent mechanical stress damage during folding.
Main Advantages
✅ High integration & high reliability: Integrated rigid‑flex
structure removes extra connectors, lowers contact failure risk and
improves whole‑device stability.
✅ Space‑saving & compact layout: Support 3D folding and
space‑saving installation, perfectly fit compact wearable and
miniature portable products.
✅ Excellent bending resistance: PI‑based flexible sections
withstand thousands of cycles of repeated bending for dynamic
application scenarios.
✅ Simplified assembly: Reduce manual welding procedures, shorten
assembly time and lower overall system‑level costs.
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