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| Categories | Memory Connectors |
|---|---|
| Height Above Board: | 1.4mm |
| MOQ: | 1 |
| Model Number: | SNO-1305-B |
| Card Connection Mode: | Hinged Lid |
| Brand Name: | SNO-1305-B |
| Delivery Time: | 1工作日 |
| Packaging Details: | SMD |
| Stock: | 1909 |
| Card Detection: | No Card Detect |
| Operating Temperature: | -35℃~+75℃ |
| Description: | Card Connector NANO SIM Hinged Lid Surface Mount |
| Connector Type: | Connector and Ejector |
| Card Type: | Nano-SIM Card |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Function: NANO-SIM Card Sockets.
Usage: Designed for consumer electronics applications requiring a NANO-SIM card interface.
Advantages: Features a hinge-type operation for easy access and secure card insertion. Precision components ensure reliability and stability. RoHS compliant for environmental standards.
Application Scenarios: Consumer Electronics.
SOFNG
SNO-1305-B
NANO-SIM Socket
Hinge Type ()
SMT ()
RoHS
Reel, Cardboard box, Vacuum Packed Bag
| Parameter | Specification | Notes |
|---|---|---|
| Contact Rating | 50mA, 24V DC | |
| Initial Contact Resistance | 50m max. (Better Product) / 80m max. (Average Product) | |
| Insulation Resistance | 100M min. at 500V DC | |
| Withstand Voltage | 500V AC for 1 minute | |
| Durable Performance (No Load) | 5,000 Cycles (Better Product) / 3,500 Cycles (Average Product) | |
| Durable Performance (Rated Load) | 3,500 Cycles (Better Product) / 2,500 Cycles (Average Product) | |
| Operating Force (Inward) | 2.54.5N | (1N.=100gram-force) |
| Operating Force (Exiting) | 2.54.5N | (1N.=100gram-force) |
| Solder-ability (IR Reflow) | Max. 255, 5sec. | |
| Solder-ability (Manual) | Max. 350, 3sec. | |
| Storage Temperature | -35+75 | (Operating Temp: Not Specified) |
| Pin No. | Pin NAME | Type | Description |
|---|---|---|---|
| C | VCC | 1 | Card Power |
| C | RST | 1 | Reset |
| C | CLK | 1 | Clock |
| C | GND | 1 | Ground |
| C | VPP | 1 | VPP |
| C | I/O | 1 | Input/Output |
| Item | Material | Plating | Description |
|---|---|---|---|
| Terminal | C5210-EH (t=0.12mm) Phosphor Bronze | Nickel (Ni 50u") + Gold (Au 1u") | |
| Housing | LCP Heat-resistant plastic (UL94V-0) | BLACK | |
| Cover | SUS304-H (t=0.20mm) Stainless Steel | Gold (Au/Ni 1u") for GND Solder Pad |
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