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| Categories | Transistor Socket |
|---|---|
| Brand Name: | 4832-6004-CP |
| Description: | 32P DIP Through Hole IC Sockets RoHS |
| MOQ: | 2880 |
| Adaptation Package Type: | DIP |
| Stock: | 2880000 |
| Model Number: | 4832-6004-CP |
| Number of Positions: | 32P |
| Packaging Details: | Through Hole |
| Delivery Time: | 33-37周 |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
The 3M DIP Socket Stamped and Formed, Dual-Wipe 4800 Series offers reliable termination with its dual leaf, high compression contact. Designed for automatic insertion compatibility with most insertion equipment, these sockets are side and end stackable. They are RoHS Compliant, with specific regulatory information available in the "RoHS Compliance" section of www.3mconnector.com (RIA E1 and C1 Apply).
| Specification | Value |
|---|---|
| Insertion Force | 340 grams max. per contact |
| Withdrawl Force | 80 grams min. per contact |
| Acceptable Pin Diameter | .010 - .011 [ 0.25 mm - 0.27 mm ] |
| Acceptable Pin Length | .100 - .130 [ 2.54 mm - 3.30 mm ] |
| Mounting Hole Diameter | .035" - .043" [ 0.90 mm - 1.10 mm ] |
| Current Rating | 1 A |
| Insulation Resistance | 5,000 M at 500 VDC |
| Withstanding Voltage | 100 VAC for 1 minute |
| Temperature Rating | -25C to +85C |
| Process Rating | 260C max. wave solder reflow only |
| Tail Option | 0 = Straight, 4 = Kinked |
| Row Spacing | 3 = .300 [ 7.62 ], 6 = .600 [ 15.24 ] |
| Part Number Prefix | Contact Quantity | Dimension A (inch [mm]) | Dimension B (inch [mm]) | Dimension C (inch [mm]) | Dimension D (inch [mm]) | Body Style |
|---|---|---|---|---|---|---|
| 48XX | 8 | .395 [10.03] | .300 [7.62] | .400 [10.16] | .300 [7.62] | A |
| 48XX | 14 | .695 [17.65] | .300 [7.62] | .400 [10.16] | .600 [15.24] | A |
| 48XX | 24 | 1.195 [30.35] | .600 [15.24] | .700 [17.78] | 1.100 [27.94] | B |
| 48XX | 48 | 2.395 [60.83] | .600 [15.24] | .700 [17.78] | 2.300 [58.42] | B |
Note: Suitable for "lead free" wave solder only. Not for reflow solder processes.
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