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DDR5 Compatible DIMM Server Cold Plate Electronics Cooling Radiator Module

High-Density DIMM Liquid Cooling Radiator for Servers

Advanced cooling solution compatible with DDR5 and MRDIMM memory modules, designed for high-performance server applications.

Technical Specifications

Structural Design: Modular cold plate with independent memory cooling fins (copper microchannels, fin density ≥ 8 fins/cm); supports narrow-pitch memory layouts (0.297-0.35 inches) and covers 8-16 memory sticks per plate
Heat Dissipation Performance: ≥22W per memory stick, thermal resistance as low as 0.05℃*cm²/W; maintains memory temperature below 50℃ under full load with PG25 coolant
Interface & Compatibility: UQD quick-connect fittings (leakage rate < 10⁻⁶ Pa*m³/s) with blind mating support (0.8mm error compensation); compatible with MRDIMM/DDR5 memory and 2U/4U server architectures
Materials & Dimensions: Electrolytic copper + aluminum alloy construction (thermal conductivity ≥ 401 W/m*K); single module weight < 250g; compatible with standard server chassis dimensions

Application Fields

AI Data Centers - Compatible with GB300/NVL72 AI servers for large language model training and inference
High-Performance Computing - Heat dissipation for supercomputing, climate modeling, and genome sequencing
Cloud Computing Servers - 2U/4U high-density rack servers for virtualized and containerized environments

Cold Plate Radiator Design

We design internal flow channels based on customer power consumption data and heat distribution patterns to meet specific temperature and uniformity requirements while maintaining optimal fluid flow resistance. Our design process includes comprehensive simulation analysis with iterative parameter adjustments to achieve thermal and hydraulic performance targets.

Advanced cold plate manufacturing process

Production Equipment

Equipment Type	Quantity	Technical Parameters
Tunnel Brazing Furnace	2 Units	Max Welding Dimension: 1000mm (W) × 250mm (H), length unlimited Max Welding Temperature: 950℃ Applicable Materials: Copper, Aluminum
Vacuum Brazing Furnace	2 Units	Max Welding Dimension: 800mm × 1200mm × 800mm Max Welding Temperature: 1200℃ Applicable Materials: Copper, Aluminum, Stainless Steel
Helium Leak Detection Equipment	2 Units	Max Testing Dimension: 2500mm × 750mm × 700mm Testing Pressure Range: 0-3MPa Testing Precision: 2g/year or ≤1×10⁻⁶ Pa*m³/s
Hydrostatic Testing Equipment	2 Units	Max Testing Dimension: 2500mm × 1500mm × 1000mm Testing Pressure Range: 0-5MPa
Pneumatic Testing Equipment	2 Units	Max Testing Dimension: Unlimited Testing Pressure Range: 0-5MPa Testing Precision: 1Pa

Advanced manufacturing and testing equipment

Advanced Brazing Technology

Our vacuum brazing process joins aluminum plates using filler metal with lower melting points than the base material, creating extremely strong joints without residual corrosive flux. This high-end technology provides uniform heating, precise temperature control, eliminates post-cleaning requirements, and minimizes part distortion.

Vacuum Brazing Furnace for aluminum cooling plates

CNC Machining process for cooling plates

Skiving production line for cooling plates

Aluminum Extrusion manufacturing process

Liquid Cooling System Technology

High-power liquid cooling systems require heat sinks capable of rapid heat absorption. Leveraging the high specific heat capacity of liquids, our systems transfer large amounts of heat through liquid flow, capable of dissipating heat ranging from several hundred watts to over one kilowatt.

Liquid Cold Plate Varieties

Buried-tube Liquid Cold Plate: Fabricated by grooving plates, burying and welding copper tubes inside, then hermetically sealing via welding. Ensures reliable liquid tightness, operational safety, and high flatness for excellent thermal contact
Inserted-tube Liquid Cold Plate: Manufactured by embedding copper tubes onto aluminum plate surfaces using welding or bonding processes, with strict flatness control for minimal thermal resistance
Channel-type Liquid Cold Plate: Internal flow channels formed on copper or aluminum substrates through drilling, extrusion, and precision machining, sealed via friction welding or high-temperature brazing
Liquid Cooling Block: For high-power chip heat dissipation with internal flow channels created through skiving fin technology to maximize heat exchange surface area

Material-Specific Cooling Products

Copper-brazed Liquid Cooling Products: GB200 liquid cooling module, H20 liquid cooling module, optical module liquid cooling module, and other copper cold plates. Compatible with phosphor copper, silver-based, nickel-based and gold-based solders.

Aluminum-brazed Liquid Cooling Products: LTS siphon radiator, die-cast electronic control liquid cooling box, power supply stamped liquid cooling plate, motor electronic control liquid cooling plate, 6G-3DRVC radiator, and other brazed liquid cooling radiators.

Stainless Steel-brazed Liquid Cooling Products: Liquid cooling manifold, DIMM liquid cooling module, and other stainless steel liquid cooling manifolds.

Key Applications

Lasers and medical equipment
EV power battery pack cooling
Power electronics and motor drive devices
Microwave 5G transmission systems
Renewable energy systems
IGBT and Power Semi-Conductor Systems
Data centers and industrial power applications
Defense systems and avionics
Fuel cells and traction systems

Detailed view of cooling plate water channels

Quality Assurance

We maintain rigorous quality standards with comprehensive testing equipment including:

1 Coordinate Measuring Machine
1 projector instrument
2 water high pressure testing machines
4 thermal resistance testing machines
2 liquid leakage testing machines

Company quality certifications for cooling plate manufacturing

Customer Service

Prompt response to all inquiries
Competitive pricing with guaranteed quality
Efficient production scheduling
Optimal transportation solutions
Comprehensive technical support

Frequently Asked Questions

Are you a trading company or manufacturer? We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
Have you exported goods before and to which regions? 60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
How many employees do you have? Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
Can you provide samples if we agree with the design? Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
What packing methods do you use? Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
Do you provide technical support for product issues? All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.

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Categories	Cold Plate
fin density:	≥ 8 fins/cm
thermal conductivity:	≥ 401 W/m·K
Place of Origin:	Dongguan，Guangdong,China
MOQ:	100pcs
Payment Terms:	T/T，paypal， Western Union,MoneyGram
Heat Dissipation Capacity:	≥ 22W
narrow-pitch memory layout:	Compatible with DIMM pitches ranging from 0.297 to 0.35 inches
Certification:	SMC
Model Number:	DIMM
Supply Ability:	50000000pcs per Month
Brand Name:	Uchi
Price:	Negotiable
Materials:	copper + aluminum alloy
Thermal Resistance:	0.05 °C·cm²/W