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Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions

Categories Communication PCB
Material: FR4-TG140
Minimum Hole Size: 0.2 mm
Price: Negotiable
Certification: UL ,IOS9000
Minimum Line Spacing: 0.1 mm
Brand Name: XSW PCB
Board Thickness: 1.6 mm
Copper Thickness: 1/1/1/1 oz
Payment Terms: Western Union
Minimum Line Width: 0.12 mm
Delivery Time: 8-15DAYS
Supply Ability: 1 Million Square feet/per month
Place of Origin: China
MOQ: 1
Layer Count: 4L
Model Number: XSWPCB
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Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions

Precision Communication PCB

Tailored for integration into wireless communication modules and IoT connectivity solutions

Product Specifications
Layer Count4L
MaterialFR4-TG140
Board Thickness1.6 MM
Copper Thickness1/1/1/1 oz
Minimum Hole Size0.2 mm
Minimum Line Width0.12 mm
Minimum Line Spacing0.1 mm
Solder Mask ColorBlue
Surface FinishENIG (Electroless Nickel Immersion Gold)
Application FieldCommunication Products
Key Features: 4-layer PCB, 0.2mm BGA pitch, with gold fingers
Xunsiwei PCB — Born for High-Speed Communication, Practitioner of 0.2mm BGA Precision Interconnection

We understand that the core of communication boards lies not in simple "layer count stacking," but in ensuring signal integrity under extreme precision scenarios. Xunsiwei focuses on BGA packaging and HDI technologies, providing deep solutions from design optimization to volume delivery for high-performance communications, IoT gateways, and intelligent electronic systems.

In-Depth Customization Capabilities

Our understanding of "customization" goes beyond simple dimensional modifications—it's about collaborative optimization starting from the design phase:

  • DFM Pre-Assessment: Intervention during your layout and routing phase to anticipate potential risks in BGA fan-out, impedance stack-up, and gold finger tracing
  • Special Process Combination Capability: Simultaneous realization of 0.2mm BGA + gold fingers + selective ENIG + impedance control on 4-layer boards, formed in one process—no secondary processing required
Reliability Assurance System
Test ItemIndustry Standard (Spot Check)Xunsiwei Standard
Electrical TestFlying probe spot check100% full inspection (flying probe + fixture), zero tolerance for open/short circuits
AOI InspectionOuter layer onlyFull-process AOI for inner and outer layers, no hiding place for fine line defects
Thermal Stress Test288℃/10S288℃/20S, 3 cycles, simulating extreme operating conditions
Impedance ConsistencyFirst article confirmationBatch sampling + SPC process control, CpK ≥ 1.33
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