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Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

Categories	Electronics Production Machinery
MOQ:	1
Price:	$28,000-28,500
Weight:	1200KG
Cycle Time:	150ms
XY Accuracy:	±0.025mm
Die Rotation:	±3°
Die Dimensions:	0.076mm0.076mm-2mm2mm
Max Angle Correction:	±15°
Max Die Ring:	152mm
Max Die Area:	119mm
Resolution Ratio:	1μm
Thimble Stroke:	2mm
Grey Scale:	256
Image Resolution:	720x540 pixels
Die Bond Pressure:	30g-250g
XY Resolution:	0.5μm
Rated Power:	1200W

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Shenzhen Hongxinteng Technology Co., Ltd.

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Product Details
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Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

Machine Features

● Front-loading and rear-loading methods, compatible with a docking station, facilitate operator operation and connection,
improving production cycle time;
● Utilizes internationally leading dual die bonding, dual dispensing, and dual wafer search systems;
● Utilizes a direct-drive motor to drive the bonding head;
● Utilizes a linear motor to drive the wafer search platform (X/Y) and feed platform (B/C);
● Utilizes an automatic angle correction system for the wafer frame;
● Equipped with an automatic wafer ring loading and unloading system, effectively improving production efficiency;
● Precision automation equipment effectively ensures that businesses improve production efficiency and reduce costs, thereby
effectively enhancing their competitiveness.

Mainly used in flip-chip applications such as 0.5-meter flexible light strips
Cycle: 150ms

Production Cycle	150ms cycle depends on chip size and bracket
XY Accuracy	±1mil(±0.025mm)
Die Rotation	±3°
Die XY Workbench
Die Dimensions	3mil×3mil-80mil×80mil (0.076mm0.076mm-2mm2mm)
Max. Angle Correction	±15°
Max. Die Ring Size	6″ (152mm) outer diameter
Max. Die Area	4.7″ (119mm) after expansion
Resolution Ratio	0.04mil (1μm)
Thimble Z Height Stroke	80mil(2mm)
Image Recognition System
Grey Scale	256 (Level Grey)
Resolution	720(H)×540(V)(Pixels)
Die Bonder’s Swing Arm-and-hand system
Swing Arm of Die Bonder	105° rotatable die bonding
Die Bond Pressure	Adjustable 30g-250g
Loading Workbench
Range of Stroke	500mmx120mm
XY Resolution	0.02mil(0.5μm)
Suitable Holder’s Size
Length	300mm-500mm
Width	80mm-120mm
Facilities Needed
Voltage/Frequency	220V AC±5%/50HZ
Compressed Air	0.5MPa(MIN)
Rated Power	1200W
Gas Consumption	40L/min
Volume and Weight
Length x Width x Height	1900×980×1620mm
Weight	1200KG

FAQ

1) This is the first time I use this kind of machine, is it easy to operate? There is an English manual or guide video that show you how to use machine. If you still have any question, please contact us by e-mail / Skype/ phone / trade manager online service. 2) If machine have any problem after I receive it, how can I do ? Free parts send to you in machine warranty period. If the part is less than 0.5KG , we pay the postage. If it exceeds 0.5KG, you need to pay the postage. 3) MOQ ? 1 set machine, mixed order is also welcomed. 4) How can I buy this machine from you? ( Very easy and flexible !) 1. Consult us about this product on line or by e-mail. 2. Negotiate and confirm the final price , shipping , payment methods and other terms. 3. Send you the proforma invoice and confirm your order. 4. Make the payment according to the method put on proforma invoice. 5. We prepare for your order in terms of the proforma invoice after confirming your full payment. 6. And 100% quality check before shipping. 7. Send your order by air or by sea. 5) Why choose us ? 1. We're a real manufacturer. 2. We have more than ten years of experience in the machine industry. 3. We provide high quality and delivery on time. 4. We provide 24 hours after-sale timely.

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Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

Machine Features

FAQ

150ms Cycle Die Bonder Machine

±1mil Accuracy Flip Chip Die Bonder Machine

±3° Die Rotation SMT Production Line Machine

Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line