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High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-052.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers RO4730G3
Layer count: 2-layer
PCB thickness: 0.6 mm
PCB size: 59.6mm x 40.5mm (
Copper weight: 1oz (equivalent to 1.4 mils or 35μm)
Surface finish: Electroless Nickel Immersion Gold (ENIG)
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High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

This is a high-quality, double-sided PCB engineered for radio frequency (RF) applications, particularly suited for antenna systems. It is fabricated using Rogers RO4730G3 antenna-grade laminate, ensuring superior electrical performance, reliability, and cost-effectiveness.


1. PCB Specifications

Specification CategoryDetails
Base MaterialRogers RO4730G3 (hydrocarbon/ceramic laminate) – Low-loss, high-frequency substrate; robust and economical alternative to traditional PTFE-based substrates.
Layer Count2 layers
Physical Dimensions- Board size: 59.6mm x 40.5mm (1 piece)- Dimensional tolerance: ±0.15mm
Design Rules – Traces & Holes- Minimum Trace/Space: 5 mil / 5 mil- Minimum Drill Size: 0.4mm
Design Rules – Vias- Via Type: Through-hole vias only (no blind vias)- Via Plating Thickness: 20 μm
Board ThicknessFinished board thickness: 0.6 mm
Copper Weight1 oz (equivalent to 35 μm) on both outer layers
Surface FinishElectroless Nickel Immersion Gold (ENIG) – Provides a flat, solderable surface with excellent oxidation resistance; optimized for RF performance.
Solder Mask- Top side: Green (LPI, Liquid Photoimageable) solder mask- Bottom side: No solder mask (exposed copper)
Silkscreen- Top side: White legend silkscreen- Bottom side: No silkscreen

2. PCB Stack-up

Layer PositionMaterialThickness
Top Layer35 μm Copper35 μm (1oz)
Core LayerRogers RO4730G30.508mm (20mil)
Bottom Layer35 μm Copper35 μm (1oz)


3. Key Material Features & Benefits (RO4730G3):

The use of Rogers RO4730G3 material provides significant advantages for RF designs:


-Optimized RF Performance: Stable dielectric constant (Dk) of 3.00 ± 0.05 at 10 GHz and an ultra-low dissipation factor of 0.0028 for reduced insertion loss.


-Low Passive Intermodulation (PIM): Ideal for cellular base station antennas where signal integrity is critical.


-Excellent Thermal Stability: High Tg >280°C and a low Thermal Coefficient of Dk (34 ppm/°C) ensure consistent electrical performance across temperature variations.


-Ease of Fabrication: Fully compatible with standard FR-4 multi-layer processing and lead-free assembly, eliminating the need for specialized PTFE treatments.


-Lightweight & Robust: Unique filler system makes the material 30% lighter than PTFE/glass and features a CTE matched to copper for enhanced reliability.


-Environmental Compliance: RoHS compliant and compatible with lead-free soldering processes.


Characteristic CategoryTechnical Specification
Stable Dielectric Constant (Dk)3.00 ± 0.05 at 10 GHz
Ultra-Low Signal LossDissipation factor of 0.0028 at 10 GHz
Superior Thermal Stability (TCDk)Thermal Coefficient of Dk: 34 ppm/°C
High Thermal Resilience- Glass Transition Temperature (Tg): >280°C- Decomposition Temperature (Td): 411°C (TGA)
Controlled Thermal Expansion (CTE)- X-axis: 15.9 ppm/°C- Y-axis: 14.4 ppm/°C- Z-axis: 35.2 ppm/°C
Efficient Heat DissipationThermal Conductivity: 0.45 W/mK

4. Typical Applications:

This PCB is ideally suited for:


-Cellular Base Station Antennas

-Various other RF and antenna applications requiring stable electrical performance and low loss.


Quality & Testing: Manufactured to IPC-Class-2 standards and undergoes 100% electrical testing prior to shipment to ensure functionality and reliability.


Artwork Format: Gerber RS-274-X– the universal industry standard, compatible with fabrication facilities worldwide.


Availability: This PCB is available for order and shipment worldwide.


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