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High-Performance 2-Layer Rogers RO3035 PCB with Immersion Gold

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-052.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers RO3035
Layer count: 2-layer
PCB thickness: 0.37mm
PCB size: 60mm × 30mm
Copper weight: 1oz (equivalent to 1.4 mils or 35μm)
Surface finish: Immersion Gold
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High-Performance 2-Layer Rogers RO3035 PCB with Immersion Gold

High-Performance 2-Layer Rogers RO3035 PCB with Immersion Gold

Rogers RO3035 ceramic-filled PTFE circuit materials are renowned for their outstanding properties, and this 2-layer rigid printed circuit board (PCB) capitalizes on these attributes to deliver high-performance results in high-frequency applications. Boasting optimized thickness, precise manufacturing parameters, and stable electrical performance across temperature fluctuations, it stands as the go-to choice for 5G, millimeter wave sub-6GHz, and massive MIMO systems.


1. PCB Specifications

ParameterSpecification
Base MaterialRogers RO3035 (ceramic-filled PTFE-based high-frequency circuit material, part of the RO3000 series)
Layer Count2 layers (top and bottom outer copper layers)
Board Dimensions60mm × 30mm per unit (1PCS)
Minimum Trace/Space5 mils (trace width) / 7 mils (trace spacing)
Minimum Hole Size0.3mm; no blind vias supported
Finished Board Thickness0.37mm
Finished Copper Weight (Outer Layers)1oz (equivalent to 1.4 mils or 35μm)
Via Plating Thickness20μm
Surface FinishImmersion Gold (delivers excellent conductivity, corrosion resistance, and compatibility with surface-mount and wire-bonding processes)
SilkscreenNo
Solder MaskNo
Quality Assurance100% electrical testing conducted prior to shipment (eliminates open/short circuit defects and guarantees consistent operational reliability)

2. PCB Stack-up Configuration

LayerThickness
Top Copper Layer (Copper_layer_1)35μm
Rogers RO3035 Substrate10 mils (0.254mm)
Bottom Copper Layer (Copper_layer_2)35μm

3. Quality Standards & Global Availability

This PCB adheres to industry-leading standards and is globally accessible, ensuring consistency, compatibility, and convenience for customers worldwide:


Artwork Format: Gerber RS-274-X


Accepted Quality Standard: IPC-Class-2


Availability: Global Accessibility



4. Rogers RO3035 Substrate: Introduction, Features & Benefits


4.1 Introduction to Rogers RO3035

Rogers RO3035 is a ceramic-filled, PTFE-based high-frequency circuit material designed to address the demands of modern wireless technologies. As part of the RO3000 series, it shares mechanical consistency with other RO3000 materials while offering a unique dielectric constant (Dk)—enabling engineers to develop multi-layer board designs without compromising on warping, reliability, or signal performance.


4.2 Key Features of Rogers RO3035

PropertyValueSignificance
Material CompositionCeramic-filled PTFE compositeBalances ultra-low signal loss with excellent mechanical strength, ideal for high-frequency use
Dielectric Constant (Dk)3.5 ± 0.05 at 10 GHz / 23°CTight tolerance ensures predictable signal propagation, critical for 5G and millimeter wave design
Dissipation Factor0.0015 at 10 GHz / 23°CUltra-low signal loss, enabling reliable operation in applications up to 30–40 GHz
Decomposition Temperature (Td)>500°CExceptional thermal resistance, suitable for high-power and high-temperature environments
Thermal Conductivity0.5 W/mKEfficient heat dissipation, reducing component operating temperatures and extending lifespan
Moisture Absorption0.04%Minimal water uptake, ensuring stable electrical performance in humid operating conditions
Coefficient of Thermal Expansion (CTE)X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C (measured from -55°C to 288°C)Low in-plane expansion matches copper, reducing thermal stress on solder joints and components

4.3 Core Benefits of Rogers RO3035

These features translate to tangible advantages for both design engineers and end-users, addressing key challenges in high-frequency system development:


High-Frequency Compatibility: Supports applications up to 30–40 GHz, making it ideal for 5G millimeter wave, automotive radar, and satellite communications systems.


Enhanced Power Amplifier Performance: Reduces operating temperatures and improves reliability in power amplifiers—critical for high-power wireless infrastructure.


Uniform Mechanical Properties: Compatible with a range of dielectric constants, enabling flexible multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards (simplifying integration of high-frequency and low-frequency circuits).


Copper-Matched Thermal Expansion: Low in-plane CTE matches copper, ensuring reliable surface-mounted assemblies (SMAs), excellent dimensional stability, and resistance to thermal fatigue—even in temperature-sensitive applications like automotive radar.


Cost-Effective Volume Production: Supports high-volume manufacturing processes with economical laminate pricing, reducing total production costs while maintaining premium performance.


5. Some Typical Applications

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes


To sum up, this two-layer Rogers RO3035 PCB is made with great precision and meets industry quality standards. It uses a high-performance base material, providing an affordable and reliable option for future high-frequency applications.


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