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| Categories | Custom PCB Assembly |
|---|---|
| Brand Name: | Xingqiang |
| Model Number: | Varies By Goods Condition |
| Place Of Origin: | China |
| Certification: | ROHS, CE |
| MOQ: | Sample,1 Pc(5 Square Meters) |
| Price: | NA |
| Packaging Details: | As Customer Requirements |
| Payment Terms: | ,T/T,Western Union |
| Pcb Standard: | IPC-A-610 E Class II-III |
| Quotation request: | Gerber Files,BOM List |
| Solder Mask Color: | Green, Red, Blue, Black, White |
| Surface Finish: | HASL, ENIG, OSP |
| Pcb Layer: | 2-Layer, 4, 6, 8, 10 Etc. |
| Test: | 100% Test |
| Material: | FR-4 |
| Min. Hole Size: | 0.1mm |
| Company Info. |
| Dongguan Xingqiang Circuit Board Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
The Type of PCB Assembly we provide is Assembly PCB, ensuring that your electronic components are assembled efficiently and accurately on the board. The Material used for our PCBs is FR-4, a popular choice known for its reliability and durability in electronic applications.Choose from different Surface Finishes such as HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservatives) to enhance the performance and longevity of your PCB assembly.When requesting a quotation for our Custom PCB Assembly service, simply provide us with the necessary files including Gerber Files and a BOM (Bill of Materials) List. Our team of experts will review your specifications and deliver a customized solution that meets your requirements.
| Feature | Description |
| Electrical Interconnection | Provides the network of traces and vias for proper signal and power flow between components. |
| Miniaturization / High Density | Allows complex circuits to be built in a small space, primarily through the use of SMT (Surface Mount Technology). |
| Reliability and Consistency | Offers stable physical support, effective thermal management, and highly repeatable electrical performance across all manufactured units. |
| Manufacturability | Enables cost-effective mass production through automated assembly processes (pick-and-place). |
| Design Flexibility | Allows the circuit layout to be fully customized for specific performance needs, such as high-speed data or high power. |
1. Solder Paste Stenciling
A solder paste (a sticky mixture of tiny solder particles and flux) is applied to the component pads on the bare PCB.This is done using a machine that forces the paste through a stainless steel stencil that has openings precisely matching the pads. This ensures that solder is only applied to the required locations.
2. Component Placement
The board moves to the Pick-and-Place Machine.This robotic equipment precisely picks up the Surface Mount Devices (SMDs) from feeders and places them onto the solder paste-covered pads according to the design file (Gerber data).The tacky solder paste holds the components in place temporarily.
3. Reflow Soldering
The assembled board passes through a Reflow Oven.The oven has multiple controlled heating zones. It gradually raises the temperature to melt the solder paste (the reflow phase) and then cools it down (the cooling phase).As the molten solder solidifies, it forms a strong, permanent electrical and mechanical bond between the component pins and the PCB pads.
4. Inspection and Quality Control
After reflow, the board undergoes rigorous inspection to check for defects:Automated Optical Inspection (AOI): A camera system scans the board to check for component presence, correct placement, polarity, and solder joint quality (e.g., bridging, insufficient solder).
X-Ray Inspection (AXI): Used for complex components like BGAs (Ball Grid Arrays) where solder joints are hidden beneath the package.
5. Through-Hole Component Insertion
Components that cannot be surface mounted (e.g., large connectors, high-power components) use Through-Hole Technology (THT).
Components are inserted manually or by machine into plated holes.
These components are typically soldered using a Wave Soldering Machine or selective soldering, where the bottom side of the board passes over a wave of molten solder.
6. Final Test and Cleaning
Functional Testing (FCT): The PCBA is powered up and tested using specialized jigs or equipment to ensure it performs its intended function.
Cleaning: The board is cleaned to remove any residual flux from the soldering process.
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