TSM-DS3 PCB built on 30mil material | fabricating large format complex multilayers with Immersion Gold for RF microwave

TSM-DS3 PCB: 2-Layer, 30mil Core, 0.8mm Thickness with Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Overview of TSM-DS3 2-Layer PCB

The TSM-DS3 PCB is a high-performance 2-layer rigid PCB designed for high-power, low-loss, and thermally stable applications. Built with TSM-DS3 materials, this PCB features a 30mil (0.762mm) core and a finished thickness of 0.8mm, providing low dielectric loss and excellent thermal conductivity.

With a dielectric constant (Dk) of 3.0 ± 0.05 and dissipation factor (Df) of 0.0014 at 10 GHz, the TSM-DS3 PCB is a reliable choice for radar systems, phased array antennas, and high-frequency automotive applications. The Immersion Gold (ENIG) surface finish ensures excellent solderability, corrosion resistance, and long-term durability.

PCB Construction Details

PCB Stackup

Introduction to TSM-DS3 Material

The TSM-DS3 laminates are ceramic-filled, reinforced materials with minimal fiberglass content (~5%), developed for high-power RF applications. These materials provide dimensional stability, low loss, and thermal reliability, combining the benefits of ceramics and traditional epoxy laminates.

Key Features of TSM-DS3

Dielectric Constant (Dk): 3.0 ± 0.05 at 10GHz / 23°C.

Dissipation Factor (Df): Low at 0.0014 at 10GHz.

Thermal Conductivity: 0.65 W/m·K for optimal heat dissipation.

Moisture Absorption: Extremely low at 0.07%.

CTE (Coefficient of Thermal Expansion): X-axis: 10 ppm/°C. Y-axis: 16 ppm/°C. Z-axis: 23 ppm/°C.

Temperature Stable Dk: ±0.25% from -30°C to 120°C.

Benefits of TSM-DS3

• Dimensional Stability: Rivals epoxy for large-format multilayer PCBs.
• Low Dielectric Loss: Suitable for high-frequency, low-loss designs.
• Thermal Stability: High thermal conductivity ensures reliable performance under high-power conditions.
• High Yield and Consistency: Compatible with standard PCB manufacturing processes.
• Resistive Foil Compatibility: Supports advanced circuit designs.

Applications

Couplers

Phased Array Antennas

Radar Manifolds

Millimeter Wave Antennas

Automotive Applications

Oil Drilling Equipment

Semiconductor/ATE Testing

Conclusion

The TSM-DS3 2-layer PCB is a premium solution for high-frequency, high-power PCB designs, offering low dielectric loss, thermal stability, and dimensional reliability. With its 30mil TSM-DS3 core, Immersion Gold finish, and green solder mask, this PCB is ideal for applications such as radar manifolds, phased array antennas, and semiconductor testing.

Compliant with IPC-Class-2 standards and available worldwide, the TSM-DS3 PCB is the perfect choice for engineers seeking cost-effective, high-performance materials for complex, high-frequency designs.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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