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Double-Sided F4BTMS220 RF PCB Board with 0.127mm Thick Core and UL-94 V0 Flame Retardancy

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-052.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: F4BTMS220
Layer count: Double sided
PCB thickness: 0.2mm
PCB size: 114mm x 20 mm=1PCS, +/- 0.15mm
Copper weight: 1oz (1.4 mils)
Surface finish: Immersion Gold
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Double-Sided F4BTMS220 RF PCB Board with 0.127mm Thick Core and UL-94 V0 Flame Retardancy

This double-sided rigid PCB is constructed with F4BTMS220, a high-performance and high-reliability base material, along with precise specifications, making it suitable for various demanding applications. Its double-sided design provides sufficient routing space for circuit connections, ensuring efficient and stable signal transmission.


PCB details

ParameterSpecification
Base materialF4BTMS220
Layer countDouble sided
Board dimensions114mm x 20 mm=1PCS, +/- 0.15mm
Minimum Trace/Space5/5 mils
Minimum Hole Size0.2mm
Blind viasNo
Finished board thickness0.2mm
Finished Cu weight1oz (1.4 mils)
Via plating thickness20 μm
Surface finishImmersion gold
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskBlack
Bottom Solder MaskNo
Electrical test prior to shipment100% used

Stack-up

This 2-layer rigid PCB has the following stack-up structure:

LayerThicknessDescription
Copper_layer_135μmResponsible for conducting electrical signals on the top surface.
F4BTMS220 Core0.127mm (5mil)Serves as the insulating base between the two copper layers.
Copper_layer_235μmHandles electrical conduction on the bottom surface.


Features of F4BTMS220

  • Dielectric Constant (Dk): At 10GHz, the dielectric constant is 2.2 +/- 0.02, ensuring stable signal transmission.

  • Dissipation Factor: It has a dissipation factor of 0.0009 at 10GHz and 0.001 at 20GHz, indicating low energy loss.

  • CTE (Coefficient of Thermal Expansion): In the temperature range of -55°C to 288°C, the CTE x-axis is 40 ppm/°C, the CTE y-axis is 50 ppm/°C, and the CTE z-axis is 290 ppm/°C, providing good thermal stability.

  • Thermal Coefficient of Dk: With a low thermal coefficient of Dk at -130 ppm/°C in the range of -55°C to 150°C, the material's dielectric properties remain stable under temperature changes.

  • UL-94 Rating: It meets the UL-94 V0 standard, offering good flame retardancy.

  • Moisture Absorption: The moisture absorption is as low as 0.02%, ensuring reliable performance in humid environments.

Artwork Type

The artwork supplied for this PCB is Gerber RS-274-X, a widely used format in the PCB industry for manufacturing.


Quality Standard

It adheres to the IPC-Class-2 quality standard, ensuring reliable performance in general electronic applications.


Availability

This PCB is available worldwide, meeting the needs of customers across different regions.


Typical Applications

This PCB, with its high-performance F4BTMS220 base material, is suitable for a wide range of applications, including:


-Aerospace equipment, space and cabin equipment

-Microwave and RF systems

-Radar, especially military radar

-Feed networks

-Phase-sensitive antennas and phased array antennas

-Satellite communications, and more.


F4BTMS Introduction

The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. Enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, it shows substantial improvements in material performance and a broader range of dielectric constants. As a high-reliability material suitable for aerospace applications, it can replace similar foreign products.


By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This leads to reduced dielectric loss, enhanced dimensional stability, and decreased X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits an excellent low thermal expansion coefficient and stable dielectric temperature characteristics.


The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.


Quality Double-Sided F4BTMS220 RF PCB Board with 0.127mm Thick Core and UL-94 V0 Flame Retardancy for sale
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