OSP Process Automotive PCB Board Double Sided IPC Class 3 Standard

Organic protective film: The OSP layer, typically 0.1-0.3μm thick, adheres tightly to the copper surface, providing oxidation resistance without compromising the original flatness of the copper.​

Double-sided application: Uniformly applied to both sides of the board, ensuring consistent protection and solderability across all exposed copper pads and traces.​

Process compatibility: Works well with standard PCB substrates (such as FR-4) and integrates seamlessly into conventional manufacturing workflows, with no negative impact on solder mask materials (e.g., red, blue, or green inks).

Excellent solderability retention: The organic film is easily removed during soldering, allowing for good wetting of the copper surface by solder, reducing the risk of cold solder joints and ensuring reliable connections, even for fine-pitch components.​

Cost-effectiveness: Compared to gold immersion or hot air solder leveling (HASL), the OSP process is simpler, requires fewer production steps, and has lower material costs, making it ideal for cost-sensitive applications.​

Environmental friendliness: Uses non-toxic organic compounds, avoiding heavy metals (like lead or gold) in large quantities, and generates less hazardous waste, aligning with modern environmental regulations.​

Thin and flat surface: The ultra-thin OSP layer does not significantly alter the board’s thickness or surface flatness, making it suitable for high-density circuit designs and applications where dimensional precision is critical.​