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4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services

Categories Multilayer PCB Board
Brand Name: xingqiang
Model Number: Varies by goods condition
Certification: ROHS, CE
Place of Origin: China
MOQ: Sample,1 pc(5 square meters)
Price: NA
Payment Terms: ,T/T,Western Union
Supply Ability: 3000㎡
Delivery Time: 12-15 work days
Min. Solder Mask Clearance: 0.1mm
Pcba Standard: IPC-A-610E
Aspect Ratio: 20:1
Board Thinkness: 1.2mm
Minimum Line Space: 3mil (0.075mm)
Surface Finishing: HASL/OSP/ENIG
Materila: FR4
Product: Print Circuit Board
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4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services

FR4 solderable 4-layer board PCB


Product Description:

Multilayer printed circuit boards (PCB) are a common type of circuit board in modern electronic devices. They consist of multiple single-sided or double-sided circuit boards stacked together with insulating materials in between, forming a single unit. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.


Advantages of Multilayer PCB:

  • High Density
  • Improved Signal Integrity
  • Better Electromagnetic Compatibility (EMC)
  • Adapt to high-frequency applications
  • Better thermal management
  • Complexity and Cost


Applications:

• Telecommunications

• Computers

• Automotive electronics

• Medical devices

• Consumer electronics

• Aerospace

• Industrial control


Manufacturing process:

  • Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
  • Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
  • Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
  • Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
  • Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).



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