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Double Sided HASL PCB OSP Surface Treatment FR4 Structure Customized Board

Categories Double Sided PCB
Brand Name: xingqiang
Model Number: Varies by goods condition
Certification: ROHS, CE
Place of Origin: China
MOQ: Sample,1 pc(5 square meters)
Price: NA
Payment Terms: ,T/T,Western Union
Supply Ability: 3000
Delivery Time: 7-10 work days
Minannularring: 0.2mm
Base Material: FR4
Pcb Thickness: 0.2mm-5.0mm
Special Requirement: impedance control
Solder Mask: Yellow PI Film, White, Black, Green,Red
Maximum Size: 528mm*600mm
Cooper: 1/1oz
Pcb Name: Double Sided ENEPIG PCB
Test: E-test/Fixture text
Copper Thickness: 1oz
Waterproof: IP20
Surface Finished: LF-HASL
Usage: Electronics
Treatment Finished: OSP
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Double Sided HASL PCB OSP Surface Treatment FR4 Structure Customized Board

Double-sided tin-plated PCB, headphone board ear plate enquipment

Double-sided hot air solder leveling (HASL) PCB is a type of printed circuit board where both sides of the substrate are treated with the hot air solder leveling process, featuring practical performance and wide adaptability. Its core characteristics are as follows:​ The surface treatment involves uniformly covering the copper surface with molten tin-lead alloy (or lead-free tin alloy), which is then leveled by hot air to form a flat, bright tin layer with moderate thickness and strong adhesion. This process endows the board with excellent solderability, ensuring good wetting of the solder during component welding, reducing the risk of cold solder joints. Moreover, the tin layer allows for multiple rework soldering, making it suitable for mass assembly and later maintenance needs.​ Meanwhile, the tin layer has certain oxidation resistance and protective capabilities, which can protect the copper surface from environmental corrosion, extend the storage and service life of the board, and is particularly suitable for general industrial environments such as humid and dusty conditions.​



Core Characteristics:

FeatureDescription
Layer StructureConductive copper layers on both top and bottom sides of the insulating substrate
InterconnectionPlated through-holes (vias) connect circuits between the two layers
Wiring CapacityDouble-sided routing enables higher wiring density and complex circuit layouts



Key Advantages​:

  • Superior solderability: The tin layer ensures excellent wetting of solder during component welding, minimizing cold solder joints. It allows multiple rework soldering, adapting to mass assembly and post-maintenance requirements.
  • Reliable protection: The tin coating provides oxidation resistance and corrosion protection for the copper surface, extending the board’s storage and service life, especially in general industrial environments (e.g., humid, dusty conditions).
  • Practical efficiency: The mature and stable HASL process enables high production efficiency and controllable costs, making it a cost-effective choice for fields like consumer electronics, home appliances, and industrial control where a balance of welding reliability and economy is required.


Quality Double Sided HASL PCB  OSP Surface Treatment FR4 Structure Customized Board for sale
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