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Engineered Copper-Polyimide Laminate for Flexible Circuits

Categories Copper Clad Polyimide Film
Brand Name: Guofeng
Model Number: 25um
Certification: SGS Reach ROHS
Place of Origin: China
MOQ: 150kg
Price: $300-$30000
Payment Terms: L/C,T/T
Supply Ability: Negotiation
Delivery Time: 7 Working Days
Packaging Details: Standard Packing
Cladding Material: Copper
Surface Treatment: Chemical Etching
Material: Polyimide
Adhesive Type: Acrylic
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Engineered Copper-Polyimide Laminate for Flexible Circuits

Engineered Copper-Polyimide Laminate for Flexible Circuits
Product Overview:

The GL series redefines the performance standard for polyimide film technology. Our proprietary biaxial stretching process creates a uniquely molecularly oriented structure, delivering greater than 30% enhancement in critical properties—from tensile strength and dimensional stability to chemical resistance—when benchmarked against conventional films. This high-performance, natural yellow polyimide film is available in customized thicknesses, establishing it as the material of choice for the most demanding applications, including high-reliability adhesive substrates and advanced chip packaging.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

Outstanding Mechanical Strength

Exceptional Dimensional Stability

Superior Laminating Properties

Conforms to RoHS and REACH regulations


Product Applications:

The GL high-performance polyimide film is primarily used in:

High-precision adhesive FCCL substrates

High-stability cover films

Chip packaging

Special adhesive tape substrates


Handling & Storage Instructions:

To ensure the longevity and performance of our Polyimide film:

  • Shelf Life: 6 months from the date of manufacture
  • Storage Conditions:
    • Store in a cool, dry place away from direct sunlight
    • Avoid exposure to high humidity or extreme temperature fluctuations
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