Semiconductor Underfill Desktop Glue Dispensing Machine automated 10KG lab

Desktop Dispensing Machine for Semiconductor Underfill Process

The VS300 Series Desktop Visual Dispensing Machine is an efficient and flexible micro-dispensing solution specially developed for semiconductor underfill, IC encapsulation, micro-assembly, and other precision electronics manufacturing tasks.

To address the strict requirements of modern underfill processes, the VS300 is equipped with real-time fluid level detection and alarm, helping prevent production interruptions due to sudden material depletion. Users can also configure the system with an optional rotation module for complex multi-angle dispensing tasks, as well as a bottom heating module to optimize material flow and curing during underfill or dam & fill applications.

Core Advantages

Applications

Technical Specifications

FAQ

Q1: How does the level detection help during underfill processes?
A: The built-in level detection sensor triggers an alarm when adhesive runs low, preventing incomplete fills and ensuring stable production without manual checks.

Q2: What’s the benefit of the rotation module?
A: The optional rotation module allows precise multi-angle dispensing on IC packages with tight corners or complex contours, reducing manual repositioning.

Q3: Why is a heated base important for underfill?
A: Bottom heating improves the flowability of underfill adhesives, helping the material penetrate tight gaps under the chip and ensuring void-free bonding.

Q4: Can the VS300 series handle different glue types?
A: Yes, the system is compatible with various piezoelectric valves, which can deal with a variety of adhesives, including epoxy, UV-curable, and high-viscosity underfill materials. Process parameters can be easily adjusted in the software.

Conclusion

Whether you are a semiconductor lab, a prototype packaging house, or a precision electronics maker looking for stable, flexible, and accurate underfill dispensing, the VS300 Series Desktop Visual Dispensing Machine delivers the advanced features you need—without the footprint or cost of large inline systems.

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technology solutions for industry-leading customers in the fields of semiconductor packaging & testing and precision electronic manufacturing, jointly promoting industry technique and technology progress.

Mingseal Technology specializes in the development and production of high-precision dispensing machines, which are widely used in advanced semiconductor packaging, consumer electronics, and automotive electronics manufacturing. Our dispensing systems feature visual control, multi-axis motion, and adaptable configurations, enabling consistent and efficient material application in complex processes.

Our products are trusted by top-tier customers across industries, and our business and technical support network spans China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia, and Mexico.

Mingseal Technology has received multiple national honors and qualifications, including National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise, and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, we will continue to invest in technological R&D, uphold values of cooperation and sharing, and work closely with customers, suppliers, employees, and partners to advance high-end intelligent manufacturing.