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| Categories | Bicheng Newly shipped PCB | 
|---|---|
| Brand Name: | Rogers | 
| Model Number: | RT/duroid 6035HTC | 
| Certification: | ISO9001 | 
| Place of Origin: | China | 
| MOQ: | 1PCS | 
| Price: | 0.99-99USD/PCS | 
| Payment Terms: | T/T, Paypal | 
| Supply Ability: | 50000pcs | 
| Delivery Time: | 2-10 working days | 
| Packaging Details: | Packing | 
RT/duroid 6035HTC PCB: 2-Layer, 30mil Core, ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Overview of the 2-Layer RT/duroid 6035HTC PCB
The 2-layer RT/duroid 6035HTC PCB is a high-performance laminate
designed for high-power RF and microwave applications. Engineered
with ceramic-filled PTFE composites, this PCB offers exceptional
thermal conductivity, low insertion loss, and excellent
high-frequency performance, making it ideal for power amplifiers,
filters, and combiners.
With a 30mil (0.762mm) core, ENIG (Immersion Gold) surface finish,
and black silkscreen, this PCB ensures thermal stability and
long-term reliability in demanding high-power RF environments.
PCB Construction Details
| Parameter | Specification | 
| Base Material | RT/duroid 6035HTC | 
| Layer Count | 2 layers | 
| Board Dimensions | 99.8mm x 61.6mm ± 0.15mm | 
| Minimum Trace/Space | 4/6 mils | 
| Minimum Hole Size | 0.3mm | 
| Blind Vias | No | 
| Finished Board Thickness | 0.8mm | 
| Copper Weight | 1oz (1.4 mils) outer layers | 
| Via Plating Thickness | 20 μm | 
| Surface Finish | Immersion Gold (ENIG) | 
| Top Silkscreen | Black | 
| Bottom Silkscreen | None | 
| Top Solder Mask | None | 
| Bottom Solder Mask | None | 
| Electrical Testing | 100% tested prior to shipment | 
PCB Stackup
The 2-layer stackup for the RT/duroid 6035HTC PCB is optimized for
high thermal conductivity and low insertion loss. Below is the
detailed stackup:
| Layer | Material | Thickness | 
| Copper Layer 1 | Copper (1oz) | 35 μm | 
| Core Material | RT/duroid 6035HTC | 0.762mm (30mil) | 
| Copper Layer 2 | Copper (1oz) | 35 μm | 
PCB Statistics
The 2-layer RT/duroid 6035HTC PCB is designed for high-power RF
circuits with the following key statistics:
Introduction to RT/duroid 6035HTC Material
RT/duroid 6035HTC is a ceramic-filled PTFE laminate developed for
high-power RF and microwave applications. Its high thermal
conductivity (1.44 W/m·K) ensures efficient heat dissipation, while
its low dissipation factor (0.0013 at 10GHz) minimizes signal loss.
The material’s advanced filler system provides excellent
drill-ability and long-term thermal stability, making it an ideal
choice for high-power designs requiring low insertion loss and
consistent performance in extreme environments.
Features of RT/duroid 6035HTC
Benefits of RT/duroid 6035HTC PCB
Applications of RT/duroid 6035HTC PCB
Why Choose the 2-Layer RT/duroid 6035HTC PCB?
The RT/duroid 6035HTC PCB is the perfect solution for high-power,
high-frequency designs requiring thermal stability, low loss, and
long-term reliability. Its 30mil core, ENIG finish, and high
thermal conductivity make it an excellent choice for
mission-critical RF and microwave applications in aerospace,
telecommunications, and satellite systems.
Contact us today to learn more about this high-performance PCB or
to place your order!
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