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1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

Categories Silicone Thermal Pad
Brand Name: Ziitek
Model Number: TIF100-12-05ES
Certification: UL & RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: 1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad
Application: CPU Graphics Card Heat Dissipation
Thickness: 0.020"(0.5mm)~0.200"(5.0mm)
Specific Gravity: 2.0g/cc
Dielectric Breakdown Voltage: ≥5500 VAC
Thermal conductivity: 1.2W/m-K
Keywords: Thermal Gap Filler Pad
Sample: Sample free
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1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Products description


The TIF®100-12-05ES Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive. They are applied to fil the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. Its smooth, puncture-, tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.


Features


> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Broad range of hardnesses available
> Moldability for complex parts


Applications


> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

> Mass storage devices
> Automotive electronics
> Set top boxes


Typical Properties of TIF®100-12-05ES Series
ColorBlueVisual
Construction & CompostionCeramic filled silicone elastomer******
Thickness range0.020"(0.5mm)~0.200"(5.0mm)ASTM D374
Specific Gravity2.0g/ccASTM D297
Hardness12±5 Shore 00ASTM 2240
Operating Temp-40 ~ 160℃******
Dielectric Breakdown Voltage≥5500 VACASTM D149
Dielectric Constant @1MHz4.5MHzASTM D150
Volume Resistivity≥1.0X1012 Ohm-cmASTM D257
Fire rating94 V0UL E331100
Thermal conductivity1.2 W/m-KASTM D5470

Product Thicknesses:

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)


Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Independent R&D team


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4. We will reply you as soon as possible with Email or online.

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