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| Categories | Technical Ceramic Parts |
|---|---|
| Brand Name: | ZG |
| Model Number: | MS |
| Certification: | CE |
| Place of Origin: | China |
| MOQ: | 1 PC |
| Price: | 10USD/PC |
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability: | 1000 PCS |
| Delivery Time: | 5-8 work days |
| Packaging Details: | Strong wooden box for Global shipping |
| Company Info. |
| HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
DPC technology (Direct Plated Copper)
Stapes of the technological process:
1. Formation of a thin continuous film of conductive material on a ceramic substrate. In this case, there may be holes in the substrate;
2. Applying a photoresist to the formed conductive layer;
3. Exposure and manifestation of photoresist;
4. Galvanic build-up of copper metallization of the required thickness;
5. Application of Ni-Au finish coating;
6. Removing the photoresist from the surface of the board;
7. Chemical etching of the conductive layer remaining on the ceramic after removing the photoresist.
Properties | Thick-film technology | DPC |
Tolerance | ± 10% | ± 1% |
Adhesion | high | high |
Surface roughness Ra, mkm | от 1 до 3 | ≤ 0,3 |
| Pages |
Technology comparance (the 5 - the best items, the 1 - the lowest items)
Properties | DPC | Thin- film technology | Thick-film technology |
Electrical conductivity | 5 | 3 | 4 |
Thermal conductivity | 5 | 3 | 4 |
Stability of parameters | 5 | 5 | 3 |
Resolution | 4..5 (определяется толщиной медного слоя) | 5 | 2 |
Cost | 5 | 2 | 2 |
| Ceramics | Thickness, mkm | Conductive material of the transition holes | Tolerance for the width of the conductor, microns | ||
Cu | Ni | Au | |||
Al2O3 | 1... 100 | 3 ... 5 | 0,075... 1 | Ag, Cu | 50 |
AlN | |||||
An equally important characteristic that determines the durability of products is the resistance of the metallized board to temperature effects. Thermal cycling testing was carried out according to MIL-STD-202.107G. This method is designed to determine the stability of a ceramic substrate with metallization to a cyclic temperature change.
Test conditions:
Test results
№ | Value, кг | Results | № | Value, кг | Results |
1 | 3,84 | + | 6 | 3,94 | + |
2 | 3,92 | + | 7 | 4,11 | + |
3 | 4,02 | + | 8 | 3,51 | + |
4 | 3,76 | + | 9 | 3,87 | + |
5 | 3,58 | + | 10 | 4,01 | + |
Average adhesion value, кг: 3,86 ± 0,18 | |||||
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