PCB Through Hole Silver Paste For Interlayer Electrical Connection

PCB Through-Hole Silver Paste is a key functional material used to achieve interlayer electrical connections in printed circuit boards (PCBs).

Core Advantages

● Cost-Effective

The simplified production process reduces the chemical plating steps, lowers production costs (claimed to reduce PCB costs by nearly 15%), and shortens the production cycle.

● Environmental Advantages

Avoids the consumption of large amounts of chemicals and the use of wash water in the chemical copper plating process which reduces the pollutants and wastewater discharge.

● Process Friendly

Suitable for application on flexible circuits and dense circuit boards, with good adhesion to materials such as phenolic boards.

Application Fields

● Consumer Electronics

Widely used in cost-sensitive home appliances and consumer electronics such as remote controls, telephones, televisions, game consoles, and recorders.

● Automotive Electronics

Used in components like automotive dashboards, adopted by well-known automotive parts suppliers such as Continental, Johnson Controls, and Marelli.

● Industrial and Communication Equipment

Also applied in industrial fields that require reliability, such as communication devices and medical instruments.

Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people.

APG specializes in the research and development (R&D) and production of PVD materials (sputtering targets and evaporation materials), pastes, and powders. These products serve industries such as PV solar cells, optics, semiconductors, smart touch and display manufacturing, Low-E glass production, permanent magnets, power batteries, and decorative and functional coating applications.

APG utilizes leading production technologies, including sintering, plasma spraying, and melting. The company produces ceramic materials, compound materials, metals, and alloy materials, and also provides bonding and backing plate services. APG possesses the necessary technology and equipment to produce both powder and pastes.

APG maintains a strong technical team and R&D department, which accounts for more than 20% of the company's total employees. This team focuses on developing new materials and technologies and holds numerous patents. Additionally, APG operates an inspection center equipped with various instruments to guarantee the stable quality of all products. APG is committed to the research, development, and production of high-performance materials and delivering excellent service to its customers.