Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

Name: Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules
Brand: Hiner-pack
Price: 1.35 USD

Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

Categories	JEDEC IC Trays
Brand Name:	Hiner-pack
Model Number:	HN24223
Certification:	ROHS, ISO
Place of Origin:	China
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day
Delivery Time:	10 workdays
Packaging Details:	CARTON, PALLET
Tray Weight:	Varies, Typically Up To 500 Grams Per Cavity
Color:	Usually black or dark gray for ESD protection
Quality Assurance:	Delivery Guarantee, Reliable Quality
Cavity Size:	3x3x0.92 mm
Incoterms:	EXW, FOB, CIF, DDU, DDP
Mold Type:	Injection
Reusable:	Yes
Tray Shape:	Rectangular
Clean Class:	General And Ultrasonic Cleaning
Ic Type:	BGA,QFP,QFN,LGA,PGA
Packing Level:	Transport package
Flatness:	Less than 0.76mm
Capacity:	14x35=490 PCS

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Company Info.

Shenzhen Hiner Technology Co., Ltd.

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Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

Looking for reliable precision JEDEC IC trays for advanced semiconductor packaging? These high-quality JEDEC IC trays are specially made for complex IC module packaging applications.

These custom JEDEC trays feature finely processed high-precision cavities that fit complex IC structures very well. They meet standard JEDEC industry requirements and can be fully customized according to your chip design drawings.

They are widely compatible with modern semiconductor packaging processes, and perfectly meet the packaging needs of SiP modules, MEMS devices and various complex IC modules.

Key Features/ Benefits

Full customization based on chip drawing
High precision cavity for complex IC structures
Excellent anti-static performance
Fast mold development

Specifications

Brand		Hiner-pack
Model		HN24223
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		3x3x0.92 mm
Matrix QTY		14x35=490 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

This MPPO high-temperature resistant JEDEC IC tray provides full protection for IC chips throughout production, testing, packaging and transportation processes. It features excellent ESD anti-static performance, making it extremely suitable for electrostatic-sensitive semiconductor devices.It is widely applied to these professional semiconductor scenarios:

High-temperature SiP system-in-package packaging processes
Precision MEMS micro-electro-mechanical device packaging & handling
Advanced high-density semiconductor module assembly
Fine Pitch IC chip packaging, testing and carrier storage
High temperature resistant semiconductor manufacturing workshops

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Professional engineering team
Stable supply for global semiconductor customers

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Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

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Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules