Dowsil SE-4485L 2.8 Coefficient Thermal Conductivity

Product Overview​​

DOWSIL™ SE 4485 is a ​​single-component, white, moisture-cure thermal adhesive​​ designed for efficient heat dissipation in electronic modules. Its key attributes include:

• ​​Formulation​​: Filled with thermally conductive fillers and based on polydimethylsiloxane (PDMS) binder.
• ​​Curing​​: Cures at room temperature (25°C) within 4–7 hours under 0–80% relative humidity.
• ​​Certifications​​: UL94 V-0 flammability rating ensures safety in electronic applications.
• ​​Color​​: White for aesthetic compatibility in visible applications.

Product Introduction​​

This thermal adhesive serves as a reliable "thermal bridge" to transfer heat from high-power components (e.g., LEDs, communication devices) to heat sinks or enclosures. Its unique properties include:

• ​​Low Stress​​: Flexible cured silicone rubber minimizes mechanical stress on sensitive electronics.
• ​​Moisture Resistance​​: Exhibits strong adhesion to metals, glass, and ceramics without requiring primers (though optional primers improve bonding on inert plastics like Teflon).
• ​​Thermal Performance​​: Delivers a ​​thermal conductivity of 2.8 W/m·K​​ (1.62 BTU/hr·ft·°F), reducing hotspots and enhancing device reliability.
• ​​Ease of Use​​: Semi-fluid consistency allows precise dispensing via automated or manual methods.

Specialized Attributes​​

Beyond standard specifications, SE 4485 stands out with:

• ​​Fast Curing​​: Achieves tack-free surface in just ​​10 minutes​​ at 25°C, accelerating production cycles.
• ​​High Strength​​: Offers ​​492 psi (3.4 MPa)​​ tensile strength and a Shore A hardness of 90 (JIS 1), balancing flexibility and durability.
• ​​Chemical Stability​​: Resists degradation from solvents and maintains performance across a wide temperature range (-45°C to 200°C / -49°F to 392°F).
• ​​Environmentally Friendly​​: Free of corrosive byproducts during curing, aligning with eco-conscious manufacturing practices.

• ​​DOWSIL™ SE 4485 Thermal Conductive Adhesive Product Introduction​​

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  ​​Product Overview​​

  DOWSIL™ SE 4485 is a ​​single-component, white, moisture-cure thermal adhesive​​ designed for efficient heat dissipation in electronic modules. Its key attributes include:

  • ​​Formulation​​: Filled with thermally conductive fillers and based on polydimethylsiloxane (PDMS) binder.
  • ​​Curing​​: Cures at room temperature (25°C) within 4–7 hours under 0–80% relative humidity.
  • ​​Certifications​​: UL94 V-0 flammability rating ensures safety in electronic applications.
  • ​​Color​​: White for aesthetic compatibility in visible applications.

  ---

  ​​Product Introduction​​

  This thermal adhesive serves as a reliable "thermal bridge" to transfer heat from high-power components (e.g., LEDs, communication devices) to heat sinks or enclosures. Its unique properties include:

  • ​​Low Stress​​: Flexible cured silicone rubber minimizes mechanical stress on sensitive electronics.
  • ​​Moisture Resistance​​: Exhibits strong adhesion to metals, glass, and ceramics without requiring primers (though optional primers improve bonding on inert plastics like Teflon).
  • ​​Thermal Performance​​: Delivers a ​​thermal conductivity of 2.8 W/m·K​​ (1.62 BTU/hr·ft·°F), reducing hotspots and enhancing device reliability.
  • ​​Ease of Use​​: Semi-fluid consistency allows precise dispensing via automated or manual methods.