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RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish

Categories Bicheng Newly shipped PCB
Brand Name: Rogers
Model Number: RO3210
Certification: ISO9001
Place of Origin: China
MOQ: 1PCS
Price: 7.8 USD/PCS
Payment Terms: T/T, Paypal
Supply Ability: 50000pcs
Delivery Time: 2-10 working days
Packaging Details: Packing
Solder Mask Colour: N/A
Copper Weight: 1oz
Customer Support: 24/7 customer support
Shipping Method: DHL/FedEx/UPS/TNT
Thermal Conductivity: 2.0W/MK 75um dielectric material
Analytics: Real-time analytics and reporting
Layer Count: 4-Layer PCB
Board Thickness: 1.6mm
Base Material: RO3210
Min. Hole To Copper: 0.2mm
Fiducial Mark: Through hole
Structure: Stencil foils with aluminum frame
Payment Method: PayPal, T/T
Layers: 1-16
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RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish

4-Layer PCB with RO3210, 1.24mm Thickness, and Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Overview of the 4-Layer PCB

This 4-layer rigid PCB is built with Rogers RO3210, a high-frequency circuit material that combines ceramic-filled laminates with woven fiberglass reinforcement, offering improved mechanical stability and uniform electrical performance. The smooth surface of RO3210 is ideal for finer line etching tolerances, ensuring reliability in complex designs.


The immersion gold (ENIG) surface finish provides excellent solderability and long-term corrosion resistance. While no solder mask or silkscreen is applied, the board is designed with precision and tested to IPC-Class-2 standards, guaranteeing quality and reliability.



2. PCB Construction Details

ParameterSpecification
Base MaterialRogers RO3210
Layer Count4 layers
Board Dimensions60mm x 55mm ± 0.15mm
Minimum Trace/Space4/6 mils
Minimum Hole Size0.3mm
Via TypeNo Blind Vias
Finished Board Thickness1.24mm
Finished Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Gold
Top Solder MaskNone
Bottom Solder MaskNone
Top SilkscreenNone
Bottom SilkscreenNone
Electrical Testing100% tested to IPC-Class-2 standards

3. PCB Stackup

The 4-layer stackup is engineered for high-frequency RF designs, balancing performance and thermal management. Here’s the structure:

LayerMaterialThickness
Copper Layer 1Copper (1oz)35 μm
Core MaterialRogers RO32100.508mm (20mil)
Copper Layer 2Copper (1oz)35 μm
Bonding LayerPrepreg0.102mm
Copper Layer 3Copper (1oz)35 μm
Core MaterialRogers RO32100.508mm (20mil)
Copper Layer 4Copper (1oz)35 μm

4. Features of Rogers RO3210

  • Dielectric Constant (Dk): 10.2 ± 0.5 at 10 GHz, delivering stable signal propagation.
  • Dissipation Factor (Df): 0.0027 at 10 GHz, minimizing signal loss.
  • Decomposition Temperature (Td): 500°C, ensuring reliability in high-heat environments.
  • Thermal Conductivity: 0.81W/mK, providing effective heat dissipation.
  • CTE (Coefficient of Thermal Expansion): X-axis: 13 ppm/°C. Y-axis: 13 ppm/°C. Z-axis: 34 ppm/°C, ensuring dimensional stability and plated-through hole reliability.
  • Flammability Rating: UL 94 V-0, meeting stringent safety standards.
  • Smooth Surface: Ideal for fine line etching tolerances, enabling precise designs.

5. Benefits of RO3210 Material


Mechanical Stability: Woven glass reinforcement improves rigidity and handling, ensuring reliable assembly.


Dimensional Stability: Low CTE provides compatibility with copper and hybrid designs, ensuring high production yields.


High Dielectric Performance: Uniform electrical properties make it suitable for multi-layer, high-frequency structures.


Finer Line Etching: Smooth surface allows for tighter tolerances in complex designs.


Cost-Effective Fabrication: Compatible with standard PTFE processing techniques, reducing production costs.



6. Applications of the 4-Layer PCB


Automotive Collision Avoidance Systems: Ensures stable signal performance in safety-critical systems.


Automotive GPS Antennas: Provides precision signal transmission for satellite navigation.


Wireless Telecommunications Systems: Ideal for base station infrastructure and broadband wireless communication.


Microstrip Patch Antennas: Suitable for compact, high-performance wireless communication designs.


Direct Broadcast Satellites: Ensures reliability in satellite communication systems.


Datalink and Power Backplanes: Suitable for efficient data transmission and power management systems.


Why Choose Bicheng Technologies?

At Bicheng Technologies Limited, we specialize in manufacturing high-quality PCBs for RF and microwave applications. Our 4-layer PCB with Rogers RO3210 material combines cutting-edge materials and precise manufacturing techniques to deliver reliable performance for your high-frequency designs.


Why Work With Us?

Global Availability: We deliver worldwide and provide excellent customer support.

High Standards: All PCBs are tested to IPC-Class-2 standards for reliable performance.

Customized Solutions: We work closely with you to meet your specific requirements.


If you’re looking for a trusted partner to bring your innovative designs to life, feel free to contact me at sales30@bichengpcb.com. Let’s collaborate to make your next project a success!



Quality RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish for sale
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