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| Categories | Thermal Graphite Sheet | 
|---|---|
| Brand Name: | Ziitek | 
| Model Number: | TS-TIR300L | 
| Certification: | RoHs | 
| Place of Origin: | China | 
| MOQ: | 1000PCS | 
| Price: | 0.1-10 USD/PCS | 
| Supply Ability: | 100000pcs/day | 
| Delivery Time: | 2-3 work days | 
| Packaging Details: | 1000pcs/bag | 
| Product name: | Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings | 
| Thickness: | 0.15mm | 
| Density: | 1.4 g/cc | 
| Thermal conductivity (Z Axis Direction): | 2.5W/m-K | 
| Hardness: | 90 Shore A | 
| Application: | Between Heat Sinks And External casings | 
| Color: | Black | 
| Keywords: | Graphite Composite Thermal Pad | 
| Company Info. | 
| Dongguan Ziitek Electronic Materials & Technology Ltd. | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings
TIR®300L Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal contact and ease of assembly. lt isideally suited for use between power transistors and heat sinks, as well as in large-areathermal interface applications.
Feature
> Excellent thermal impedance
> Replaces traditional thermal grease
> High reliability
> Easy to apply to surfaces
Application
> Between transistors and heat sinks
> Between mechanical structures
> Between heat sinks and externalcasings
| Typical Properties of TIR®300L series | |||
| Product Name | TIR®300L | Test Method | |
| Colour | Black | Visual | |
| Reinforcement Carrier | Aluminum | ***** | |
| Thickness range | 0.15 mm | ASTM D374 | |
| Hardness | 90 Shore 00 | ASTM D2240 | |
| Density | 1.4g/cc | ASTM D792 | |
| Volume Resistivity(ohm-cm) | 1*102 | ASTM D257 | |
| Continuous Use Temperature | -60℃~ 180℃ | Ziitek Test Method | |
| Thermal Conductivity(W/mK) | 2.5 | ASTM D5470 | |
| Thermal impedance(℃-in2/W)@30psi | 0.3 | ASTM D5470 | |
| Thermal impedance(℃-in2/W)@50psi | 0.25 | ASTM D5470 | |
| 180° Peel Strength | 1.0N/25mm | ASTM D3330 (Steel,Immediate) | |

Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
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