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TIF700R Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF700R
Certification: RoHS
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: TIF700R Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone
Materials: Ceramic filled silicone elastomer
Keywords: Thermal Pad
Hardness: 30±10 Shore 00
Specific Gravity: 3.55g/cc
Thermal conductivity: 8.5W/mK
Application: GPU CPU Heatsink Cooling
Sample: Sample free
Flame rating: 94-V0
Color: Gray
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TIF700R Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone

TIF700R Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone


Product descriptions


TlF700R use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features

> Good thermal conductive 8.5W/mK
> Outstanding thermal performance
> High tack surface reduces contact resistance
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts


Application

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module

Typical Properties of TIF700R Series
PropertyValueTest method
ColorGray*****
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity3.55g/ccASTM D297
Thickness range0.020"(0.50mm)~0.200"(5.0mm)ASTM D374
Hardness (thickness ≥1.0mm)30±10 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃*****
Dielectric Breakdown Voltage>4000 VACASTM D149
Dielectric Constant5.5MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity

8.5W/m-K

ASTM D5470

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Quality TIF700R Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone for sale
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