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| Categories | Thermal Conductive Silicone Glue |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIS580-13 |
| Certification: | UL and RoHs |
| Place of Origin: | Vietnam |
| MOQ: | 10KG |
| Price: | 0.1-10 USD/kg |
| Payment Terms: | T/T |
| Supply Ability: | 10000KG/month |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 1kg/can |
| Products name: | Black Paster TIS580-13 One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Glue |
| Material: | Silicone Adhesive |
| Thermal Conductivity: | 1.3W/mk |
| Appearance: | Black Paste |
| Hardness: | 25(Shore A) |
| Keywords: | Thermally Conductive Silicone Glue |
| Total Cure Time: | 3-7 Days (25℃) |
| Company Info. |
| CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM |
| Verified Supplier |
| View Contact Details |
| Product List |
Blcak Paster TIS580-13 One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Glue
TIS™580-13 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.
TIS™580-13 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.
TIS™580-13 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

Feature
> Good thermal conductivity: 1.3W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Application
| Typical values of TISTM580-13 | ||
| Appearance | Black paste | Test Method |
| Density(g/cm3,25℃) | 1.4 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7days | ***** |
| Elongation(psi) | ≥150 | ASTM D412 |
| Hardness(Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength(N/mm) | >3.5 | ASTM D1876 |
| Operation temperature(℃) | -60~250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 10 | ASTM D149 |
| Dielectric Constant ( @ 1MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.3 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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