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| Categories | Silicone Thermal Pad |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIF100C 6050-11 |
| Certification: | RoHS and UL recognized |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | 0.1-10 USD/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 1000000 pcs/month |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 24*13*12cm cartons |
| Products name: | 6W/MK Thermally Conductive Silicone Pad Thermal Silicone Sheet Gap Pad For Electronics |
| Hardness: | 50 Shore 00 |
| Color: | Gray |
| Keywords: | Silicone Thermal Gap Pad |
| Flam rating: | 94 V-0 |
| Thinkness range: | 0.012"(0.30mm)~0.200"(5.00mm) |
| Thermal Conductivity: | 6.0W/mK |
| Application: | Electronics Cooling |
| Company Info. |
| Dongguan Ziitek Electronical Material and Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
6W/MK Thermally Conductive Silicone Pad Thermal Silicone Sheet Gap Pad For Electronics
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.
Features:
> Excellent thermal conductivity 6.0W/mK
> Self-adhesive without the need for additional surface adhesive
> Highly compressible, soft, and elastic
> Available in various thicknesses
> Good chemical stability
Applications:
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)
> Industrial equipment
> Network communication devices
> New energy vehicles
| Typical Properties of TS-TIF®100C 6050-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.3g/cc | ASTM D297 |
| thickness | 0.012"(0.30mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 50(Shore 00) | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 7.0MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 6.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
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