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| Categories | RF PCB Board |
|---|---|
| Brand Name: | Bicheng |
| Certification: | UL, ISO9001, IATF16949 |
| Place of Origin: | CHINA |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 5000PCS per month |
| Delivery Time: | 8-9 working days |
| Packaging Details: | Vacuum bags+Cartons |
| Material: | RO4835 dielectric 20 mil （0.508mm) |
| Layer count: | 2-layer |
| PCB size: | 77.55mm x 167.5mm=1 PCS, +/- 0.15mm |
| PCB thickness: | 0.6mm |
| Copper weight: | 1oz (1.4 mils) outer layers |
| Surface finish: | Immersion Gold |
| Company Info. |
| Bicheng Electronics Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
Introducing the Rogers RO4835 PCB, engineered for high frequency performance and exceptional reliability. This advanced laminate is crafted from Rogers' RO4835 material, which offers enhanced thermal stability and superior oxidation resistance compared to traditional hydrocarbon materials. With properties similar to RO4350B laminates, the RO4835 is perfect for cost-effective circuit fabrication while maintaining high performance standards.
Key Features
-RoHS Compliant: Meets environmental standards for applications requiring UL 94 V-0.
-IPC-4103 Compliant: Adheres to industry standards for quality and
reliability.
-Dielectric Constant: 3.48 ± 0.05, ensuring controlled impedance
for critical applications.
-Dissipation Factor: Low at 0.0037 at 10 GHz, promoting efficient
signal transmission.
-Glass Transition Temperature: Exceeds 280 °C, supporting
high-temperature applications.
-Coefficient of Thermal Expansion: Low values ensure dimensional
stability across axes.
| Property | RO4835 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | - | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -100℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 108 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 7 x108 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 30.2(755) | Z | Kv/mm(v/mil) | IPC-TM-650 2.5.6.2 | |
| Tensile Modulus | 7780(1128) | Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 136(19.7) | Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 186 (27) | Mpa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 31 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.66 | W/m/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.05 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.92 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Benefits
-Oxidation Resistance: Delivers significantly improved durability
over typical thermoset microwave materials.
-Low Loss Performance: Ideal for high-frequency applications,
including automotive systems.
-Tight Tolerances: Controlled dielectric constant for precision in
transmission lines.
-Lead-Free Compatibility: Ensures no issues with blistering or
delamination during processing.
-Stable Dimensions: Low expansion coefficients maintain reliability
in plated through holes.
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4835 |
| Dielectric constant: | 3.48 (10 GHz) |
| Dissipation Factor | 0.0037 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness (ED copper) | 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| Dielectric thickness (LoPro copper) | 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
This PCB is constructed as a 2-layer rigid board, providing a robust platform for high-frequency applications. Each side is finished with 35 μm of copper, ensuring effective conductivity and signal integrity throughout the circuit.
The dielectric layer comprises 20 mils (0.508 mm) of RO4835 material, contributing to the PCB's low loss performance. Overall, the board has a total thickness of 0.6 mm, suitable for a wide range of electronic components.
For precision manufacturing, the PCB allows for a minimum trace and space of 6/8 mils, along with a minimum hole size of 0.3 mm, enabling complex designs. The surface finish is achieved through immersion gold, enhancing solderability and durability, while the top layer features white silkscreen for clear labeling, leaving the bottom layer free of silkscreen for a streamlined appearance.
Artwork and Compliance
Artwork Type:Gerber RS-274-X
Accepted Standard: IPC-Class-2
Service Area: Worldwide
Typical Applications
The Rogers RO4835 PCB is ideal for:
-Automotive Radar and Sensors
-Point-to-Point Microwave Communication
-Power Amplifiers
-Phased-Array Radar Systems
-RF Components
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