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| Categories | eMMC5.1 | 
|---|---|
| Brand Name: | PG | 
| Model Number: | G2516GMLCA | 
| Place of Origin: | China | 
| Price: | Negotiable | 
| Payment Terms: | L/C, T/T | 
| Supply Ability: | 100K a month | 
| Delivery Time: | 10 to 15 days | 
| Capacity: | 8GB-512GB | 
| Agreement: | HS400 | 
| Read speed: | Up to 330MB/s | 
| Write speed: | Up to 240MB/s | 
| Operating temperature: | -25℃~+85℃ | 
| Choice of Flash: | MLC/3DTLC/QLC NAND | 
| MOQ: | 50pcs | 
| Company Info. | 
| China Chips Star Semiconductor Co., Ltd. | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
| Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA | 
| NAND flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 
| Capacity | 64GB | 128GB | 256GB | 512GB | 
| CE | 1 | 2 | 4 | 4 | 
| Read speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s | 
| Write speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s | 
| Operating temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | 
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 | 
| Packaging specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 | 
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm | 
Technical details of eMMC chip
Pin definition
PCB design considerations
Advantages of eMMC chips
Suitability for mobile devices
Data security and reliability
In short, eMMC chips play a crucial role in modern mobile devices due to their high efficiency, reliability and easy integration.

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