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| Categories | Solder Paste Machine | 
|---|---|
| Brand Name: | HSTECH | 
| Model Number: | HS-GLE | 
| Certification: | CE | 
| Place of Origin: | China | 
| MOQ: | 1 set | 
| Price: | Negotiable | 
| Payment Terms: | T/T, Western Union, MoneyGram | 
| Supply Ability: | 100 sets per month | 
| Delivery Time: | 7~9 work days | 
| Packaging Details: | Wooden package | 
| Product Name: | Automatic Solder Paste Printer | 
| Warranty: | 1 Year | 
| Control: | Touch screen | 
| Relay Brand: | Schneider | 
| Optoelectronic Switch: | OMRON | 
| Material: | Aluminum Alloy | 
| Condition: | New | 
| Signal: | SMEMA | 
| Application: | Electronic Assembly | 
| Color: | Silver | 
| Control System: | PLC | 
| OEM/ODM: | Available | 
| Power Consumption: | 200W | 
| Type: | Automatic | 
| Company Info. | 
| Shenzhen Hansome Technology Co., Ltd. | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
Image And Optical System Cleaning System GKG Special Adjustment Jacking Platform Automatic Solder Paste Printer
Introduction
GLE Automatic solder paste printing machine is a high-end machine for SMT large-scale applications. The width of Gt-S is only 2830mm. It can perfectly meet the printing process requirements of 01005,0.3pitch and other fine spacing, it's high precision and high speed.
Features
1, GKG special adjustment jacking platform. Stable and easy to adjust, it can quicklyadjust the pin jacking height of PCB with different thickness.
2, Cleaning system: GKG cleaning system equipped with three cleaning methods: dry cleaning, wet cleaning, vacuum. which can be combined to use. It can also be cleaned by manual if customer do not need to use automatic cleaning to reduce the cleaning time and improve production efficiency.
The newly wiping system ensures full contact with the stencil, increased vacuum suction can effectively eliminate the remaining paste in the mesh, which can achieve effective automatic cleaning function.CCD part and c leaning system is separated, when CCD working, CCD part independently move to reduce the servo motor load and improve the machine speed and accuracy.
| Model | GLE | 
| Max PCB Size | 510x510mm | 
| Min PCB size | 50x50mm | 
| PCB thickness | 0.4-6mm | 
| Max board weight | 5kg | 
| Transport height | 900±40mm | 
| Board edge gap | 2.5mm | 
| Board height | 23mm | 
| Transport direction | L-R,R-L | 
| Transport speed | max 1500mm/s, program control | 
| Transport method | One stage | 
| WIdth adjustment | automatic | 
| I/O interface | SMEMA | 
| PCB positioning (support method) | Magnetic pin/support block/up-down table | 
| PCB clamping system | Patented over the top clamping | 
| Side clamping | |
| Adsorption function | |
| Print snap-off | 0-20mm | 
| Print mode | one/twice | 
| Print Speed | 10-200mm/sec | 
| Print Mode | One /Twice | 
| Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) | 
| Print pressure | 0.5-10kg | 
| Template fram size | 470*370mm~737*737mm | 
| Cleaning System | Droops of rain type cleaning system | 
| Reinforced vacuum absorption | |
| Dry, wet vacuum three modes | |
| CCD FOV | 10x8mm | 
| Fiducial mark types | Standard Fiducial mark shape | 
| Pad | |
| Hole | |
| Camera system | Look up/down optics structure | 
| CCD digital camera | |
| Geometry pattern match | 
Machine Performance
| Model | GLE | 
| Repeat position accuracy | ±12.5um@6,CPK≥2.0 | 
| Print accuracy | ±20um@6,CPK≥2.0 | 
| Print cycle time | <7.5 sec | 
| Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision | |
Whole Machine Specification
| Power supply | AC:220±10%,50/60HZ, 3.0KW | 
| Air pressure | 4~6 kgf/cm² | 
| Air consumption | around 5L/min | 
| Operating temperature | -20℃~+45℃ | 
| Operating humidity | 30%~60% | 
| Machine Dimensions(without tower light) | 1240(L) x 1410(W) x 1500 (H)mm | 
| Machine Weight | Approx: around 1100Kg | 




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