Sign In | Join Free | My entremaqueros.com
entremaqueros.com
Products
Search by Category
Home >

60.7mil RO4725JXR PCB Board With ENIG On Pads No Top Or Bottom Silkscreen Or Solder Mask

Categories High Speed PCB
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD 9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

60.7mil RO4725JXR PCB Board With ENIG On Pads No Top Or Bottom Silkscreen Or Solder Mask

Today, we are exciting to update the introduction of RO4725JXR antenna grade PCB, which offers a reliable and efficient alternative to traditional PTFE-based laminates commonly used in antenna design.


RO4725JXR antenna grade laminates possess exceptional mechanical and electrical properties, allowing antenna designers to achieve significant gain values while minimizing signal loss. These materials are compatible with standard epoxy and high-temperature lead-free solder processing. They also eliminate the need for special treatment during plated through hole preparation, and lamination can be accomplished using the RO4400 bondply series at a temperature of 175°C.


Here are some key details from the data sheet:


RO4725JXR has a process dielectric constant of 2.55 ± 0.05 in the Z direction at 10 GHz and 23°C, as measured by the IPC-TM-650, 2.5.5.5 test method. Its design dielectric constant is 2.64 in the Z direction at frequencies ranging from 1.7 GHz to 5 GHz, measured by the differential phase length method.


The material exhibits a dissipation factor of 0.0026 in the Z direction at 10 GHz and 23°C, according to the IPC-TM-650, 2.5.5.5 test method. At 2.5 GHz, the dissipation factor is 0.0022.


Its thermal coefficient of dielectric constant is +34 ppm/°C in the Z direction across a temperature range of -50°C to 150°C, as measured by the IPC-TM-650, 2.5.5.5 test method.


The volume resistivity is 2.16 X 10^8 MΩ•cm, and the surface resistivity is 4.8 X 10^7 MΩ, both measured under COND A using the IPC-TM-650, 2.5.17.1 test method.


The material demonstrates a remarkably low PIM (Passive Intermodulation) value of -166 dBc at 50 ohm on 0.060" thick material, with a power level of 43 dBm at 1900MHz.


PropertyTypical ValueDirectionUnitsConditionTest Method
Dielectric Constant, εr Process2.55 ± 0.05Z10 GHz/23°CIPC-TM-650, 2.5.5.5
Dielectric Constant, εr Design2.64Z1.7 GHz - 5
GHz
Differential Phase Length Method
Dissipation Factor0.0026Z10 GHz/23°CIPC-TM-650, 2.5.5.5
0.00222.5GHz
Thermal Coefficient of εr+34Zppm/°C-50°C to 150°CIPC-TM-650, 2.5.5.5
Volume Resistivity (0.030")2.16 X 10^8MΩ•cmCOND AIPC-TM-650, 2.5.17.1
Surface Resistivity (0.030")4.8 X 10^7MΩCOND AIPC-TM-650, 2.5.17.1
PIM-166dBc50 ohm
0.060”
43dBm
1900MHz
Electrical Strength (0.030”)630ZV/milIPC-TM-650, 2.5.6.2
Flexural Strength MD121 (17.5)MPa
(kpsi)
RTASTM D790
CMD92 (13.3)
Dimensional Stability<0.4X,Ymm/mafter etch
+E2/150°C
IPC-TM-650, 2.4.39A
Coefficient of Thermal
Expansion
13.9Xppm/°C-55 TO 288°CIPC-TM-650, 2.1.24
19.0Y
25.6Z
Thermal Conductivity0.38ZW/mK°50°CASTM D5470
Moisture Absorption0.24%%48/50IPC-TM-650 2.6.2.1 ASTM D570
Tg>280°CIPC-TM-650 2.4.24
Td439°CASTM D3850
Density1.27gm/cm3ASTM D792
Copper Peel Strength8.5pli1 oz LoPro EDCIPC-TM-650 2.4.8
Lead-Free Process CompatibleYES

It has an electrical strength of 630 V/mil at 0.030", as measured by the IPC-TM-650, 2.5.6.2 test method.


The flexural strength is 121 MPa in the MD (Machine Direction) and 92 MPa in the CMD (Cross-Machine Direction), determined by the ASTM D790 test method at room temperature.


RO4725JXR exhibits dimensional stability of less than 0.4 mm/m in the X and Y directions after etching, under the E2/150°C condition, as measured by the IPC-TM-650, 2.4.39A test method.


Its coefficient of thermal expansion is 13.9 ppm/°C in the X direction, 19.0 ppm/°C in the Y direction, and 25.6 ppm/°C in the Z direction across a temperature range of -55°C to 288°C, according to the IPC-TM-650, 2.1.24 test method.


The thermal conductivity of RO4725JXR is 0.38 W/mK° at 50°C, as measured by the ASTM D5470 test method.


Its moisture absorption is 0.24% at 48 hours and 50ºC, measured by the IPC-TM-650 2.6.2.1 and ASTM D570 test methods.


The material has a Tg (glass transition temperature) value greater than 280°C, measured by the IPC-TM-650 2.4.24 test method, and a Td (decomposition temperature) value of 439°C, measured by the ASTM D3850 test method.


Its density is 1.27 gm/cm3, as measured by the ASTM D792 test method.


The copper peel strength is 8.5 pli for 1 oz LoPro ED copper, according to the IPC-TM-650 2.4.8 test method.


RO4725JXR is also compatible with lead-free processes.


PCB Material:Hydrocarbon / Ceramic / Woven Glass
Designation:RO4725JXR
Dielectric constant:2.55 (10 GHz)
Dissipation factor0.0026 (10 GHz)
Layer count:Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:1oz (35µm), 2oz (70µm)
Dielectric thickness30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..


In conclusion, the introduction of RO4725JXR antenna grade PCB offers antenna designers a reliable and efficient alternative to traditional PTFE-based laminates. This material provides exceptional mechanical and electrical properties while minimizing signal loss. Its low PIM performance, reaching levels even better than -164dBc, ensures high-quality voice, data, and video communications in antenna systems.


By choosing RO4725JXR as the PCB material for base station antennas and other passive components like couplers and filters, designers can achieve low PIM levels without compromising electrical and mechanical performance. The selection of the right PCB material is crucial in determining the final achievable PIM, and RO4725JXR proves to be a superior option in this regard.


Quality 60.7mil RO4725JXR PCB Board With ENIG On Pads No Top Or Bottom Silkscreen Or Solder Mask for sale
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0