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| Categories | Thermal Gap Pad |
|---|---|
| Brand Name: | ZIITEK |
| Model Number: | TIF7200HM thermal pad |
| Certification: | IATF16949 |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | negotiation |
| Supply Ability: | 100000pcs/day |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 1000pcs/bag |
| name: | Fire Rating 94 V0 Good Thermal Conductive Thermal Conductive Pad For Notebook |
| keyword: | thermal gap pad |
| material: | silicone |
| Applications: | Monitoring the Power Box |
| Thermal conductivity: | 6.0 W/m-K |
| Company Info. |
| Dongguan Ziitek Electronic Materials & Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Fire Rating 94 V0 Good Thermal Conductive Thermal Conductive Pad For Notebook
The TIF7200M is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features
> Good thermal conductive: 6.0 W/mK
>Thickness: 5.0mmT
>hardness:45±5 shore 00
>Colour: Grey
>Electrically isolating
>High durability
>Good thermal conductive
Applications
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>CPU
>display card
Typical Properties of TIF7200HM Series | ||||
Color | Grey | Visual | Composite Thickness | Thermal Impedance@10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific gravity | 3.3 g/cm3 | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
| Thickness | 5.0mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 45±5 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
| Thermal conductivity | 6.0W/mk | ISO22007-2.2 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 4.5MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 1.0X1012 Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 6.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
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